2-1674770-5 TE Connectivity, 2-1674770-5 Datasheet

2-1674770-5

Manufacturer Part Number

2-1674770-5

Description

HARD HTRAY ASSY MASK MPGA478

Manufacturer

TE Connectivity

Type

PGA Socketr

Datasheet

1.2-1674770-5.pdf (1 pages)

Specifications of 2-1674770-5

Number Of Contacts

478POS

Grid Size

26x26

Contact Plating

Gold

Mounting Style

Surface Mount

Contact Material

Copper Alloy

Operating Temp Range

-65C to 200C

Product Height (mm)

3mm

Gender

SKT

Body Orientation

Straight

Insertion Force

Zero

Voltage Rating

600VAC

Pcb Mount Style

Surface Mount

Grid Spacing (mm [in])

1.27 x 1.27 [.050 x .050]

Chip Compatibility

Intel® Pentium® 4 (mPGA478B pattern)

Frame Style

Open

Heat Sink Attachment

Without

Zif Actuator

Screwdriver/Cam

Profile

Low

Cover Material

High Temperature Thermoplastic

Leg Style

Ball Grid Array (BGA)

Socket Identifier

mPGA478B

Socket Overall Height (mm [in])

3 [0.118]

Number Of Positions

478

Assembly Process Feature

Pick and Place Cover, Tape

Cover Color

Purple

Contact Style

Stamped + Formed

Contact Base Material

Copper Alloy

Contact Plating, Mating Area, Material

Gold (30)

Housing Color

Black

Housing Material

High Temperature Thermoplastic

Ul Flammability Rating

UL 94V-0

Housing Material Temperature

High

Rohs/elv Compliance

RoHS compliant, ELV compliant

Lead Free Solder Processes

Reflow solder capable to 245°C

Rohs/elv Compliance History

Always was RoHS compliant

Application

Production

Packaging Method

Tray

Packaging Quantity

Lead Free Status / RoHS Status

Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

2-1674770-5

Manufacturer:

TYCO

Quantity:

241

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2 - 1674770

Products

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Documentation & Additional Information

Product Drawings:

Catalog Pages/Data Sheets:

Product Specifications:

Application Specifications:

Instruction Sheets:

CAD Files: (

Product Features

Product Type Features:

Termination Related Features:

Body Related Features:

Contact Related Features:

2 - 1674770

PACKING ASSY mPGA47X SOCKET LEAD FREE BALL

English)

None Available

mPGA SOCKET 479&478X (3H) CAM TYPE for Mobile PC

Japanese)

None Available

mPGA Socket 479&478X (3H) CAM TYPE for Mobile PC

Japanese)

2D Drawing

3D Model

Insertion Force

Number of Positions

PCB Mount Style = Surface Mount

Grid Size

Grid Spacing (mm [in])

x .050]

Chip Compatibility

(mPGA478B pattern)

Frame Style

Heat Sink Attachment

ZIF Actuator

Profile

Cover Material = High Temperature

Thermoplastic

Leg Style = Ball Grid Array (BGA)

Comment = Sn/Ag/Cu solderballs.

Socket Identifier = mPGA478B

Pick and Place Cover = Tape

Cover Color = Purple

Socket Overall Height (mm [in]) = 3 [0.118]

Contact Style

Contact Material = Copper Alloy

Contact Mating Area Plating = Gold (30)

Products

Active

Documentation

CAD Format & Compression Information

= Low

- 5 Product Details

By Type

= 26x26

(IGES, Version K)

(STEP, Version K)

(DXF, Version K)

= Open

- 5

= Screwdriver/Cam

(Please use the Product Drawing for all design activity)

= Stamped + Formed

= Zero

Socket/Card Products

Home

= Intel ® Pentium ® 4

PGA Sockets

= 478

Resources

Product Highlights:

Products

= Without

= 1.27 x 1.27 [.050

Always EU RoHS/ELV Compliant

Zero Insertion Force

Number of Positions = 478

PCB Mount Style = Surface Mount

Grid Size = 26x26

Grid Spacing = 1.27 x 1.27 mm

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Housing Related Features:

Industry Standards:

Operation/Application:

Packaging Related Features:

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> Product Details

(PDF,

(

Statement of Compliance

(PDF,

Housing Color = Black

Housing Material = Thermoplastic High

Temperature

Housing Flammability Rating = UL 94V

Housing Material Temperature = High

RoHS/ELV Compliance

compliant

Lead Free Solder Processes

capable to 245°C

RoHS/ELV Compliance History = Always was

RoHS compliant

Application

Packaging Method = Tray

Packaging Quantity = 30

Brand = AMP

(PDF,

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