1674770-8 TE Connectivity, 1674770-8 Datasheet
1674770-8
Manufacturer Part Number
1674770-8
Description
HARD TRAY ASSY MPGA479M W/TAPE
Manufacturer
TE Connectivity
Type
PGA Socketr
Datasheet
1.1674770-8.pdf
(1 pages)
Specifications of 1674770-8
Number Of Contacts
479POS
Number Of Contact Rows
Not Required
Pitch (mm)
Not Requiredmm
Grid Size
26x26
Contact Plating
Gold
Mounting Style
Surface Mount
Contact Material
Copper Alloy
Operating Temp Range
-65C to 105C
Product Height (mm)
3mm
Gender
SKT
Body Orientation
Straight
Insertion Force
Zero
Current Rating
3A
Voltage Rating
250VAC
Pcb Mount Style
Surface Mount
Grid Spacing (mm [in])
1.27 x 1.27 [.050 x .050]
Chip Compatibility
Intel® Pentium® 4 (mPGA479M pattern)
Frame Style
Open
Heat Sink Attachment
Without
Zif Actuator
Screwdriver/Cam
Profile
Low
Cover Material
High Temperature Thermoplastic
Leg Style
Ball Grid Array (BGA)
Socket Identifier
mPGA479M
Socket Overall Height (mm [in])
3 [0.118]
Number Of Positions
479
Assembly Process Feature
Pick and Place Cover, Tape
Cover Color
Black
Contact Style
Stamped + Formed
Contact Base Material
Copper Alloy
Contact Plating, Mating Area, Material
Gold (30)
Housing Color
Black
Housing Material
High Temperature Thermoplastic
Ul Flammability Rating
UL 94V-0
Housing Material Temperature
High
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C
Rohs/elv Compliance History
Always was RoHS compliant
Application
Production
Packaging Method
JEDEC Hard Tray
Packaging Quantity
600 sockets/box
Lead Free Status / RoHS Status
Compliant
1674770
Products
Home
Documentation & Additional Information
Product Drawings:
Catalog Pages/Data Sheets:
Product Specifications:
Application Specifications:
Instruction Sheets:
CAD Files: (
Product Features
Product Type Features:
Termination Related Features:
Body Related Features:
Contact Related Features:
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1674770
PACKING ASSY mPGA47X SOCKET LEAD FREE BALL
English)
None Available
mPGA SOCKET 479&478X (3H) CAM TYPE for Mobile PC
Japanese)
None Available
mPGA Socket 479&478X (3H) CAM TYPE for Mobile PC
Japanese)
2D Drawing
3D Model
3D Model
Insertion Force
Number of Positions
PCB Mount Style = Surface Mount
Grid Size
Grid Spacing (mm [in])
x .050]
Chip Compatibility
(mPGA479M pattern)
Frame Style
Heat Sink Attachment
ZIF Actuator
Profile
Cover Material = High Temperature
Thermoplastic
Leg Style = Ball Grid Array (BGA)
Comment = With mask tape 75 micro thick.;
Sn/Ag/Cu solderballs.
Socket Identifier = mPGA479M
Pick and Place Cover = Tape
Cover Color = Black
Socket Overall Height (mm [in]) = 3 [0.118]
Contact Style
Contact Material = Copper Alloy
Contact Mating Area Plating = Gold (30)
Products
- 8 Product Details
Active
Documentation
CAD Format & Compression Information
>
= Low
By Type
= 26x26
(IGES, Version K)
(STEP, Version K)
- 8
(DXF, Version K)
= Open
= Screwdriver/Cam
(Please use the Product Drawing for all design activity)
= Stamped + Formed
>
= Zero
Socket/Card Products
Home
= Intel ® Pentium ® 4
PGA Sockets
= 479
Resources
Product Highlights:
Products
?
?
?
?
?
= Without
|
= 1.27 x 1.27 [.050
Always EU RoHS/ELV Compliant
Zero Insertion Force
Number of Positions = 479
PCB Mount Style = Surface Mount
Grid Size = 26x26
Grid Spacing = 1.27 x 1.27 mm
View all Features
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Housing Related Features:
Industry Standards:
Operation/Application:
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> Product Details
(PDF,
(
Statement of Compliance
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Privacy Policy
(PDF,
Housing Color = Black
Housing Material = Thermoplastic High
Temperature
Housing Flammability Rating = UL 94V
Housing Material Temperature = High
RoHS/ELV Compliance
compliant
Lead Free Solder Processes
capable to 245°C
RoHS/ELV Compliance History = Always was
RoHS compliant
Application
Packaging Method
Packaging Quantity = 600 sockets/box
Brand = AMP
(PDF,
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Additional Information:
Related Products:
= Production
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Product Line Information
Tooling
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= JEDEC Hard Tray
)
|
= RoHS compliant, ELV
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