2-1674770-6 TE Connectivity, 2-1674770-6 Datasheet

2-1674770-6

Manufacturer Part Number

2-1674770-6

Description

HARD HTRAY ASSY CAP TYPE MPGA478

Manufacturer

TE Connectivity

Type

PGA Socketr

Datasheet

1.2-1674770-6.pdf (1 pages)

Specifications of 2-1674770-6

Number Of Contacts

478POS

Number Of Contact Rows

Not Required

Pitch (mm)

Not Requiredmm

Grid Size

26x26

Contact Plating

Gold

Mounting Style

Surface Mount

Contact Material

Copper Alloy

Product Height (mm)

3mm

Gender

SKT

Body Orientation

Straight

Insertion Force

Zero

Pcb Mount Style

Surface Mount

Grid Spacing (mm [in])

1.27 x 1.27 [.050 x .050]

Chip Compatibility

Intel® Pentium® 4 (mPGA478B pattern)

Frame Style

Open

Heat Sink Attachment

Without

Zif Actuator

Screwdriver/Cam

Profile

Low

Cover Material

High Temperature Thermoplastic

Leg Style

Ball Grid Array (BGA)

Socket Identifier

mPGA478B

Socket Overall Height (mm [in])

3 [0.118]

Number Of Positions

478

Assembly Process Feature

Pick and Place Cover, Plastic CAP

Cover Color

Purple

Contact Style

Stamped + Formed

Contact Base Material

Copper Alloy

Contact Plating, Mating Area, Material

Gold (30)

Housing Color

Black

Housing Material

High Temperature Thermoplastic

Ul Flammability Rating

UL 94V-0

Housing Material Temperature

High

Rohs/elv Compliance

RoHS compliant, ELV compliant

Lead Free Solder Processes

Reflow solder capable to 245°C

Rohs/elv Compliance History

Always was RoHS compliant

Application

Production

Packaging Method

Tray

Packaging Quantity

Lead Free Status / RoHS Status

Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

2-1674770-6

Manufacturer:

TYCO

Quantity:

209

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2 - 1674770

Products

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Documentation & Additional Information

Product Drawings:

Catalog Pages/Data Sheets:

Product Specifications:

Application Specifications:

Instruction Sheets:

CAD Files: (

Product Features

Product Type Features:

Termination Related Features:

Body Related Features:

Contact Related Features:

2 - 1674770

PACKING ASSY mPGA47X SOCKET LEAD FREE BALL

English)

None Available

mPGA SOCKET 479&478X (3H) CAM TYPE for Mobile PC

Japanese)

None Available

mPGA Socket 479&478X (3H) CAM TYPE for Mobile PC

Japanese)

2D Drawing

3D Model

Insertion Force

Number of Positions

PCB Mount Style = Surface Mount

Grid Size

Grid Spacing (mm [in])

x .050]

Chip Compatibility

(mPGA478B pattern)

Frame Style

Heat Sink Attachment

ZIF Actuator

Profile

Cover Material = High Temperature

Thermoplastic

Leg Style = Ball Grid Array (BGA)

Comment = Sn/Ag/Cu solderballs.

Socket Identifier = mPGA478B

Pick and Place Cover = Plastic CAP

Cover Color = Purple

Socket Overall Height (mm [in]) = 3 [0.118]

Contact Style

Contact Material = Copper Alloy

Contact Mating Area Plating = Gold (30)

Products

Active

Documentation

CAD Format & Compression Information

= Low

- 6 Product Details

By Type

= 26x26

(IGES, Version K)

(STEP, Version K)

(DXF, Version K)

= Open

- 6

= Screwdriver/Cam

(Please use the Product Drawing for all design activity)

= Stamped + Formed

= Zero

Socket/Card Products

Home

= Intel ® Pentium ® 4

PGA Sockets

= 478

Resources

Product Highlights:

Products

= Without

= 1.27 x 1.27 [.050

Always EU RoHS/ELV Compliant

Zero Insertion Force

Number of Positions = 478

PCB Mount Style = Surface Mount

Grid Size = 26x26

Grid Spacing = 1.27 x 1.27 mm

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Housing Related Features:

Industry Standards:

Operation/Application:

Packaging Related Features:

Other:

> Product Details

(PDF,

(

Statement of Compliance

(PDF,

Housing Color = Black

Housing Material = Thermoplastic High

Temperature

Housing Flammability Rating = UL 94V

Housing Material Temperature = High

RoHS/ELV Compliance

compliant

Lead Free Solder Processes

capable to 245°C

RoHS/ELV Compliance History = Always was

RoHS compliant

Application

Packaging Method = Tray

Packaging Quantity = 30

Brand = AMP

(PDF,

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