B32560J6154K189 EPCOS Inc, B32560J6154K189 Datasheet - Page 24

• Manufacturer Part Number: B32560J6154K189
• Manufacturer: EPCOS Inc

Specifications of B32560J6154K189

• Tolerance (+ Or -): 10%
• Voltage: 400VDC/200VAC
• Temp Coeff (dielectric): PLYE
• Mounting Style: Through Hole
• Construction: Radial
• Failure Rate: Not Required
• Product Diameter (mm): Not Requiredmm
• Product Depth (mm): 6.5mm
• Lead Spacing (nom): 7.5mm
• Lead Diameter (nom): 0.5mm
• Operating Temp Range: -55C to 125C
• Capacitance: .15uF
• Package / Case: Not Required
• Lead Free Status / RoHS Status: Compliant

1.3
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Uncoated capacitors
For uncoated MKT capacitors with lead spacings 10 mm (B32560/B32561) the following mea-
sures are recommended:
Please read Cautions and warnings and
Important notes at the end of this document.
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
Pre-heating with a maximum temperature of 110 C
Temperature inside the capacitor should not exceed the following limits:
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
pre-heating to not more than 110 C in the preheater phase
rapid cooling after soldering
MKP/MFP 110 C
MKT 160 C
General notes on soldering
B32560 ... B32564
General purpose (stacked) SilverCap
max
. Long exposure to temperatures above this type-related temperature limit
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