B32654A7224J3 EPCOS Inc, B32654A7224J3 Datasheet - Page 34

• Manufacturer Part Number: B32654A7224J3
• Manufacturer: EPCOS Inc

Specifications of B32654A7224J3

• Lead Free Status / RoHS Status: Supplier Unconfirmed

3
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Important notes at the end of this document.
Embedding of capacitors in finished assemblies
B32651 ... B32656
High pulse (wound)
Page 34 of 40