SFELA10M7HA00 Murata, SFELA10M7HA00 Datasheet - Page 100
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SFELA10M7HA00
Manufacturer Part Number
SFELA10M7HA00
Description
Manufacturer
Murata
Datasheet
1.SFELA10M7HA00.pdf
(115 pages)
Specifications of SFELA10M7HA00
Rad Hardened
No
Lead Free Status / RoHS Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SFELA10M7HA00-B0
Manufacturer:
MURATA
Quantity:
9 333
27
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. The component may be damaged if excess mechanical
2. Design layout of components on the PC board to
3. After installing chips, if solder is excessively applied to
4. The component may be damaged during mounting
5. When correcting chips with a soldering iron, the tip of the
6. Cleaning or washing of the component is not acceptable
7. In case of covering filter with over coat, conditions such
8. Accurate test circuit values are required to measure
9. For safety purposes, connect the output of filters to the IF
1. Do not use this product with bend. The component
2. The component may be damaged when an excessive
3. All kinds of re-flow soldering must not be applied
4. Do not clean or wash the component as it is not
5. Please contact Murata or Murata representative for
6. Do not use strong acidity flux, more than 0.2wt%
98
Notice (Handling)
may be damaged if excess mechanical stress is
applied to it mounted on the printed circuit board.
stress is applied.
on the component.
hermetically sealed.
soldering condition, in case of using lead free
solder.
chlorine content, in flow soldering.
Ceramic Trap 4.5-6.5MHz Chip Type
Ceramic Trap 3.5-6.5MHz Lead Type
stress is applied to it mounted on the printed circuit
board.
minimize the stress imposed on the warp or flexure of the
board.
the circuit board, mechanical stress will cause destruction
resistance characteristics to lower. To prevent this, be
extremely careful in determining shape and dimension
before designing the circuit board diagram.
process if some part of mounter such as positioning
claws or nozzle are worn down. The regular maintenance
recommended for mounters should be done to prevent
troubles.
soldering iron should not directly touch the chip
component.
due to non sealed construction.
as material of resin, cure temperature, and so on should
be evaluated carefully.
electrical characteristics. It may be a cause of
miscorrelation if there is any deviation, especially stray
capacitance, from the test circuit in the specification.
amplifier through a D.C. blocking capacitor. Avoid
applying a direct current to the output of ceramic filters.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
7. In case of covering filter with over coat,
8. Accurate test circuit values are required to
9. For safety purposes, connect the output of filters
conditions such as material of resin, cure
temperature, and so on should be evaluated
carefully.
measure electrical characteristics. It may be a
cause of miscorrelation if there is any
deviation, especially stray capacitance, from the
test circuit in the specification.
to the IF amplifier through a D.C. blocking
capacitor. Avoid applying a direct current to the
output of ceramic filters.
[Component direction]
[Component layout close to board]
Perforation
A
Slit
B
C
Susceptibility to
stress is in the order
of : A>C>B
Put the compon-
ent lateral to
the direction in
which stress
acts.
P50E.pdf
08.1.29