DFCH31G84HDJAA-RD1 Murata, DFCH31G84HDJAA-RD1 Datasheet - Page 21

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DFCH31G84HDJAA-RD1

Manufacturer Part Number
DFCH31G84HDJAA-RD1
Description
Manufacturer
Murata
Datasheet

Specifications of DFCH31G84HDJAA-RD1

Operating Temperature Max Deg. C
85C
Rad Hardened
No
Lead Free Status / RoHS Status
Compliant
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. When handling products, be careful not to flaw
2. When handling products, be careful not to touch
3. Do not apply excessive pressure or shock to
Reflow standard condition
Test condition of
reflow heat resistance
outer-electrode. If you flaw outer-electrode, the
device don't satisfy the specifications.
outer-electrode with bare hand. If you touch
outer-electrode with bare hand, the soldering
performance of device is reduced.
product in handling or transportation because
the ceramic material which is used inside might
be destructed.
Notice
Reel
Reflow Soldering Conditions
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
160
140
100
tp1
tp2
25
0
Measuring point of temperature : IN-OUT Terminals of The Device
Reflow Soldering : Both Convection and Infrared Rays, Hot Air and Hot Plate
D
Pre-heating
C
60 to 120
260+5/-0
tp0 (˚C)
245 5
B
tp1 (˚C)
220
240
T1 (sec.)
30 to 60
T1
T2
Peak temperature tp0
20
tp2 (˚C)
220
Time (sec.)
W1
W2
T2 (sec.)
70
Notice/Packaging/Soldering and Mounting
Wide
12
16
24
32
44
A 2.0
Allowable Reflow Soldering Temperature and Time
ø178
ø330
ø178
ø330
ø330
ø330
ø330
260
250
240
230
220
210
200
190
180
0
B 0.5
ø13
ø13
ø13
ø13
ø13
ø13
ø13
60
C 0.8
ø21
ø21
ø21
ø21
ø21
ø21
ø21
120
D 0.5
Time (sec.)
2
2
2
2
2
2
2
N min.
180
ø50
ø50
ø50
ø50
ø50
ø50
ø50
W1 1.5
13.5
13.5
17.5
17.5
25.5
33.5
45.5
240
W2 max.
18.5
18.5
(in mm)
23
23
31
39
51
300
O81E.pdf
19
07.7.23
2

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