SE-FGG324-H Actel, SE-FGG324-H Datasheet - Page 4

• Manufacturer Part Number: SE-FGG324-H
• Description: MCU, MPU & DSP Development Tools Ball Land Grid Array Sockt Scrw Lock Type
• Manufacturer: Actel

Specifications of SE-FGG324-H

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Stencil
Table 1 shows the recommended stencil dimensions. A laser-cut, electro-polished and Ni-plated
stainless steel stencil is recommended to give the most consistent paste release. The apertures
can be made round except for smaller pitches, where square apertures are recommended.
Remember to keep the stencil small enough to fit within the keep-out area of the socket, but yet
have provisions to remove it from the PCB once the paste has been applied.
Table 1: Recommended stencil dimensions.
Solder Paste
E-tec recommends using solder paste without ( or <0.5%) silver (Ag) to reduce the solder’s
wetting ability and prevent the paste from running up the pins, thus maximizing the volume of
solder left on the pads. Brands such as Qualitek (www.qualitek.com) or Alpha Metals
(www.alphametals.com) produce such solder paste on customer request. For Sn/Pb solder paste
we recommend Ecorel 803S offered by Avantec (www.avantec.dehon.com).
Reflow Profile
Both standard Sn-Pb eutectic and Pb-free reflow profiles are shown below.
E-tec Socket Mounting Recommendations
PRELIMINARY
Socket Mounting Recommendations and Reflow Profile
Device Pitch
(mm)
E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland
1.27
1.00
0.80
0.75
0.65
0.50
Phone [phone] ·
PCB Pad Diameter
min. 0.60 / 0.023
min. 0.50 / 0.019
min. 0.35 / 0.014
min. 0.30 / 0.012
min. 0.40 / 0.016
min. 0.35 / 0.014
(mm / in)
www.e-tec.com
Stencil Thickness
0.15 / 0.006
0.15 / 0.006
0.13 / 0.005
0.13 / 0.005
0.13 / 0.005
0.13 / 0.005
(mm/in)
·
[e-mail]
square 0.39 / 0.015
square 0.33 / 0.013
square 0.39 / 0.015
round 0.66 / 0.026
round 0.55 / 0.022
round 0.44 / 0.017
Stencil Aperture
(mm/in)
2