TGC4402 TriQuint, TGC4402 Datasheet - Page 10

• Manufacturer Part Number: TGC4402
• Description: Wireless Accessories 17 - 27GHz Upconverting Mixer
• Manufacturer: TriQuint

Specifications of TGC4402

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1061136

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Component placement and adhesive attachment assembly notes:
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Reflow process assembly notes:
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Interconnect process assembly notes:
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Vacuum pencils and/or vacuum collets are the preferred method of pick up.
Air bridges must be avoided during placement.
The force impact is critical during auto placement.
Organic attachment (i.e. epoxy) can be used in low-power applications.
Curing should be done in a convection oven; proper exhaust is a safety concern.
Use AuSn (80/20) solder and limit exposure to temperatures above 300°C to 3-4 minutes, maximum.
An alloy station or conveyor furnace with reducing atmosphere should be used.
Do not use any kind of flux.
Coefficient of thermal expansion matching is critical for long-term reliability.
Devices must be stored in a dry nitrogen atmosphere.
Thermosonic ball bonding is the preferred interconnect technique.
Force, time, and ultrasonics are critical parameters.
Aluminum wire should not be used.
Devices with small pad sizes should be bonded with 0.0007-inch wire.
TriQuint Semiconductor: www. triquint.com [phone] Fax [phone] [e-mail]
TGC4402
Ordering Information
Part
Assembly Notes
May 2007 © Rev A
GaAs MMIC Die
Package Style
TGC4402
10