TGS2306 TriQuint, TGS2306 Datasheet - Page 7
![no-image](/images/manufacturer_photos/0/6/680/triquint_sml.jpg)
TGS2306
Manufacturer Part Number
TGS2306
Description
Wireless Accessories DC - 18 GHz SPDT Switch
Manufacturer
TriQuint
Datasheet
1.TGS2306.pdf
(8 pages)
Specifications of TGS2306
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
1023348
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TGS2306
Manufacturer:
MINMAX
Quantity:
1 000
Company:
Part Number:
TGS2306-EPU
Manufacturer:
MINI
Quantity:
1 400
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
For optimum insertion loss and return loss, a single 0.001” bondwire of length
35 mils should be used. This will be approximately 0.42nH. Differences in
bondwire length will have an impact on switch performance.
V
DC blocks are required for the RF input and output.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
C1
& V
C2
can be applied from either side of the MMIC.
Chip Assembly & Bonding Diagram
Advance Product Information
November 9, 2004
TGS2306-EPU
7