TGS2313 TriQuint, TGS2313 Datasheet - Page 9
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TGS2313
Manufacturer Part Number
TGS2313
Description
Wireless Accessories 4-18GHz SP3T VPIN Switch
Manufacturer
TriQuint
Datasheet
1.TGS2313.pdf
(9 pages)
Specifications of TGS2313
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
1058215
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TGS2313
Manufacturer:
Skyworks
Quantity:
1 400
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Reflow process assembly notes:
Component placement and adhesive attachment assembly notes:
Interconnect process assembly notes:
TriQuint Semiconductor Texas: www.triquint.com Phone (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
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Use AuSn (80/20) solder with limited exposure to temperatures at or above 300 °C for 30 sec.
An alloy station or conveyor furnace with reducing atmosphere should be used.
No fluxes should be utilized.
Coefficient of thermal expansion matching is critical for long-term reliability.
Devices must be stored in a dry nitrogen atmosphere.
Vacuum pencils and/or vacuum collets are the preferred method of pick up.
Air bridges must be avoided during placement.
The force impact is critical during auto placement.
Organic attachment can be used in low-power applications.
Curing should be done in a convection oven; proper exhaust is a safety concern.
Microwave or radiant curing should not be used because of differential heating.
Coefficient of thermal expansion matching is critical.
Thermosonic ball bonding is the preferred interconnect technique.
Force, time, and ultrasonics are critical parameters.
Aluminum wire should not be used.
Discrete FET devices with small pad sizes should be bonded with 0.0007-inch wire.
Maximum stage temperature is 200 °C.
Assembly Process Notes
TGS2313
May 2008
9