TGA8344-SCC TriQuint, TGA8344-SCC Datasheet - Page 10

• Manufacturer Part Number: TGA8344-SCC
• Description: Wireless Accessories 2.0-18GHz LNA AGC
• Manufacturer: TriQuint

Specifications of TGA8344-SCC

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1004385

RECOMMENDED
ASSEMBLY
DIAGRAM
TriQuint Semiconductor Texas Phone: [phone]
RF connections: Bond using two 1.0-mil diameter, 20 to 30-mil-length gold bond wires at both RF Input and
RF Output for optimum RF performance.
V- = V
Two on-chip to on-chip wire bonds are needed for bond pads 3 and 13.
Close placement of external components is essential to stability.
Refer to TriQuint’s Gallium Arsenide Products Designers’ Information on our website
under Application Information.
1
- = V
2
-
Fax: [phone] Web: www.triquint.com
Product Data Sheet
TGA8344-SCC
10