ZMXM-400-1-B CEL, ZMXM-400-1-B Datasheet - Page 10

• Manufacturer Part Number: ZMXM-400-1-B
• Description: Zigbee / 802.15.4 Modules & Development Tools Matrix Zigbee 10mW 10MW Module
• Manufacturer: CEL

Specifications of ZMXM-400-1-B

• Wireless Frequency: 2405 MHz to 2480 MHz
• Interface Type: UART
• Operating Voltage: 3.6 V
• Output Power: 100 mW
• Antenna: PCB Trace
• Operating Temperature Range: - 45 C to + 125 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

SHIPMENT, HANDLING, AND STORAGE
Shipment
Matrix Modules are delivered in single piece, or 50 piece cartons in individual anti-static bags.
Handling
Matrix Modules are designed and packaged to be processed in an automated assembly line.
!Warning
destroy or damage the module permanently.
!Warning
and precautions are summarized in Section 2.1. Read carefully to prevent permanent damages due to moisture intake.
Moisture Sensitivity Level (MSL)
MSL 3, per J-STD-033
Storage
Storage/Shelf life in sealed bags is 12 months at <40ºC and <90% relative humidity.
PROCESSING
Reflow Soldering
A convection soldering oven is recommended over the infrared radiation type oven. Convection ovens allow more precise
temperature control, and more even heating of parts regardless of material composition, thickness, or color.
Preheat Phase
Initial heating of component leads and solder paste balls, for removal of residual humidity.
Note: The preheat phase is not intended to replace prior baking procedures.
• Temperature rise rate: 0.8-1.7ºC/sec
Note: Excessive slumping can result if the temperature rise is too rapid.
• Time: 60-120 seconds
Note: If the preheat is insufficient, large solder balls tend to be generated. Conversely, if preheat is excessive,
• End Temperature: 150-200ºC
Heating/Relow Phase
The temperature rises above the liquidus temperature of the solder paste selected.
Avoid a sudden rise in temperature as any slump of the solder paste could become worse.
• Limit time above liquidus temperature to 35-90 seconds.
• Peak reflow temperature: 230-250ºC
small and large balls will be generated in clusters.
Matrix Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may
According to JEDEC ISP, Matrix Modules are moisture sensitive devices. Appropriate handling instructions
ZMXM-400 Series