ZAXM-201-1-ES CEL, ZAXM-201-1-ES Datasheet - Page 14

• Manufacturer Part Number: ZAXM-201-1-ES
• Description: Zigbee / 802.15.4 Modules & Development Tools Apex Zigbee 100mW Engineer Sample
• Manufacturer: CEL

Specifications of ZAXM-201-1-ES

• Wireless Frequency: 2.4 GHz to 2.5 GHz
• Interface Type: SPI, I2C, UART
• Security: 128 bit AES
• For Use With/related Products: XAP2b
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PROCESSING
Recommended Reflow Profile
Parameters Values
Achieve the brightest possible solder fillets with a good shape and low contact angle.
Pb-Free Soldering Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of the solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
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The best approach is to consider using a “no clean” soldering paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the Module to the host board, consider optical inspection to check the following:
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Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and
the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which is
not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
Ultrasonic cleaning could damage the module permanently.
Proper alignment and centering of the module over the pads.
Proper solder joints on all pads.
Excessive solder or contacts to neighboring pads, or vias.
Ramp up rate (from Tsoakmax to Tpeak)
Minimum Soak Temperature
Maximum Soak Temperature
Soak Time
TLiquidus
Time above TL
Tpeak
Time within 5º of Tpeak
Time from 25º to Tpeak
Ramp down rate
IPC specification. See IPC-A-610-D Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations.
3º/sec max
150ºC
200ºC
60-120 sec
217ºC
60-150 sec
260 + 0ºC
20-30 sec
8 min max
6ºC/sec max
ZAXM-200 Series