QZX563C6V8C-7 Diodes Inc, QZX563C6V8C-7 Datasheet
QZX563C6V8C-7
Manufacturer Part Number
QZX563C6V8C-7
Description
DIODE ZENER QUAD 6.8V SOT563
Manufacturer
Diodes Inc
Datasheet
1.QZX563C6V8C-7.pdf
(3 pages)
Specifications of QZX563C6V8C-7
Voltage - Zener (nom) (vz)
6.8V
Voltage - Forward (vf) (max) @ If
900mV @ 10mA
Current - Reverse Leakage @ Vr
1µA @ 3V
Configuration
2 Pair Common Anode
Power - Max
150mW
Mounting Type
Surface Mount
Package / Case
SOT-563
Operating Temperature
-65°C ~ 150°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ESD Capability
Maximum Ratings
Thermal Characteristics
Electrical Characteristics
Peak Power Dissipation, 10x1000μS Waveform (Note 5)
Peak Power Dissipation, 8x20μS Waveform (Note 5)
Forward Voltage @ I
Forward Voltage @ I
Power Dissipation (Note 4)
Thermal Resistance, Junction-to-Ambient (Note 4)
Operating and Storage Temperature Range
Features
•
•
•
•
•
•
•
•
•
Notes:
QZX563C6V8C
Document number: DS30716 Rev. 4 - 2
QZX563C6V8C
Number
Quad TVS in Common Anode Configuration
Nominal Zener Voltage: 6.8V
Ultra-Small Surface Mount Package
Ideal For Transient Suppression
Lead Free By Design/RoHS Compliant (Note 1)
"Green Device" (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
IEC 61000-4-2 Contact Method: ±8kV
IEC 61000-4-2 Air Discharge Method: ± 25kV
Type
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Short duration pulse test used to minimize self-heating effect.
4. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. Suggested Pad Layout Document AP02001,
5. Non-repetitive current pulse per Figure 2 & 3 and derate above T
which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
F
F
Marking
Code
= 10mA (Note 3)
= 100mA (Note 3)
CB
Characteristic
Characteristic
@T
Reverse Standoff Voltage
A
= 25°C unless otherwise specified
V
Top View
RWM
V
5
and Leakage
@T
A
= 25°C unless otherwise specified
I
R
@ V
1.5
μA
RWM
Bottom View
Min (V)
www.diodes.com
6.47
Breakdown Voltage
A
1 of 3
V
= 25°C per Figure 1.
BR
Mechanical Data
Nom (V)
(Note 3)
@ I
Symbol
Symbol
T
•
•
•
•
•
•
•
•
J,
R
6.8
P
P
V
V
T
T
θ JA
Please click here to visit our online spice models database.
pk
F
F
D
STG
= 1mA
Case: SOT-563
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminal Finish: Matte Tin, Annealed Over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Orientation: See Diagram
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.003 grams (approximate)
Device Schematic
C
C
4
1
Max (V)
7.14
NC
A
QUAD SURFACE MOUNT TVS ARRAY
C
C
2
3
-65 to +150
Maximum Reverse
Value
Value
1.0
μA
150
833
0.9
1.0
10
80
(Note 3)
Current
I
R
@ V
R
3.0
V
QZX563C6V8C
Typical Junction
C
© Diodes Incorporated
Capacitance
°C/W
Unit
Unit
T
mW
°C
W
f = 1MHz
V
V
@ V
pF
63
R
July 2008
= 0V,
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QZX563C6V8C-7 Summary of contents
Page 1
... STG = 25°C unless otherwise specified A Breakdown Voltage (Note 1mA R RWM BR T μA Min (V) Nom (V) Max (V) 1.5 6.47 6.8 = 25°C per Figure www.diodes.com QZX563C6V8C QUAD SURFACE MOUNT TVS ARRAY Value Unit 0.9 V 1.0 V Value Unit 150 mW 833 °C/W °C -65 to +150 Maximum Reverse ...
Page 2
... Fig. 4 Typical Leakage Current vs. Reverse Voltage 100 www.diodes.com QZX563C6V8C TIME (ms) Fig. 2 Pulse Waveform REVERSE VOLTAGE (V) R 6. BREAKDOWN VOLTAGE (V) BR Fig. 6 Breakdown Voltage vs. Test Current © Diodes Incorporated 3 6 July 2008 ...
Page 3
... Ordering Information (Note 6) Part Number QZX563C6V8C-7 Notes: 6. For packaging details our website at http://www.diodes.com/datasheets/ap02007.pdf. Marking Information Date Code Key Year 2005 2006 Code S T Month Jan Feb Mar Code Package Outline Dimensions Suggested Pad Layout Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein ...