MBA02040C5603FRP00 Vishay, MBA02040C5603FRP00 Datasheet - Page 11

• Manufacturer Part Number: MBA02040C5603FRP00
• Description: MBA/SMA 0204-50 1% RP 560K
• Manufacturer: Vishay
• Series: 5063JD Spacemiserr
• Type: Thin Filmr

Specifications of MBA02040C5603FRP00

• Resistance (ohms): 560K
• Power (watts): 0.4W
• Composition: Metal Film
• Temperature Coefficient: ±100ppm/°C
• Tolerance: ±1%
• Size / Dimension: 0.063" Dia x 0.142" L (1.60mm x 3.60mm)
• Lead Style: Through Hole
• Package / Case: Axial
• Resistance In Ohms: 560K
• Case: Axial
• Power Rating(s): 2/5W
• Resistance: 560kohm
• Tolerance (+ Or -): 1%
• Termination Style: Axial
• Operating Temp Range: -55C to 155C
• Case Style: Conformal
• Failure Rate: Not Required
• Lead Spacing (nom): Not Requiredmm
• Product Length (mm): 3.6mm
• Product Depth (mm): Not Requiredmm
• Product Height (mm): Not Requiredmm
• Construction: Cylindrical
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Height: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 5063JD560K0F; 5063JD560K0F; 5063JD560K0F12AF2; 5063JD560K0F12AF2; 5063JD560K0F12AF5

MBA/SMA 0204, MBB/SMA 0207, MBE/SMA 0414 - Professional
Vishay Beyschlag
Note
(1)
(2)
(3)
(4)
www.vishay.com
32
TEST PROCEDURES AND REQUIREMENTS
CLAUSE
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.13
4.19
4.29
4.18.2
4.17
4.22
4.16
4.7
4.40
60115-1
± (0.4 % R + 0.05 Ω) for MBE/SMA 0414
± (0.8 % R + 0.05 Ω) for MBE/SMA 0414
± (0.2 % R + 0.05 Ω) for MBE/SMA 0414
± (0.4 % R + 0.05 Ω) for MBE/SMA 0414
IEC
METHOD
60068-2-
21 (Ua
30 (Db)
30 (Db)
14 (Na)
45 (XA)
21 (Ub)
21 (Uc)
20 (Tb)
20 (Ta)
13 (M)
2 (Ba)
1 (Aa)
6 (B4)
TEST
IEC
-
-
-
1
)
of temperature
Robustness of
soldering heat
Rapid change
Resistance to
Voltage proof
(human body
terminations
Solderability
Electrostatic
Damp heat,
Damp heat,
Component
sequence:
Short time
resistance
discharge
pressure
Vibration
Dry heat
overload
Climatic
Low air
solvent
model)
TEST
cyclic
cyclic
Cold
For technical questions, contact:
Professional Thin Film Leaded Resistors
30 min at LCT = - 55 °C
30 min at UCT= 155 °C
U = 2.5 x
6 h; 10 Hz to 2000 Hz
MBA/SMA 0204: 2 kV
MBB/SMA 0207: 4 kV
MBE/SMA 0414: 6 kV
Stability for product
types:
Tensile, bending and
solder bath method;
solder bath method;
1.5 mm or 196 m/s
Room temperature;
+ 23 °C; toothbrush
90 % to 100 % RH;
95 % to 100 % RH;
U = 2 x U
U
MBA/SMA 0204:
MBB/SMA 0207:
MBE/SMA 0414:
Isopropyl alcohol
IEC 61340-3-1;
3 pos. + 3 neg.
PROCEDURE
15 °C to 35 °C
55 °C; 5 days;
RMS
components;
+ 235 °C; 2 s
+ 245 °C; 3 s
155 °C; 16 h
8.5 kPa; 2 h;
(260 ± 3) °C;
SnAg3Cu0.5
55 °C; 24 h;
Unmounted
MBA/SMA 0204
MBB/SMA 0207
- 55 °C; 2 h
MBE/SMA 0414
500 cycles
200 cycles
100 cycles
(10 ± 1) s
5 cycles
5 cycles
SnPb40
method
1 cycle
torsion
= U
P
max.
ins
70
; 60 s
x R
; 5 s
or
2
[e-mail]
± (0.5 % R + 0.05 Ω)
± (0.1 % R + 0.01 Ω)
± (0.1 % R + 0.01 Ω)
± (0.5 % R + 0.05 Ω)
± (0.1 % R + 0.01 Ω)
± (0.1 % R + 0.01 Ω)
± (0.1 % R + 0.01 Ω)
1 Ω to 2.4 MΩ
1 Ω to 332 kΩ
1 Ω to 1 MΩ
STABILITY
CLASS 0.5
no visible
no visible
no visible
damage
damage
damage
Good tinning (> 95 % covered, no visible damage)
PERMISSIBLE CHANGE (ΔR max.)
No flashover or breakdown
± (0.5 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
± (0.5 % R + 0.05 Ω)
REQUIREMENTS
no visible damage
± (1 % R + 0.05 Ω)
Marking legible;
0.22 Ω to < 1 Ω
0.22 Ω to < 1 Ω
0.22 Ω to < 1 Ω
STABILITY
CLASS 1
no visible
no visible
no visible
damage
damage
damage
Document Number: 28766
± (0.5 % R + 0.05 Ω)
Revision: 23-Jul-10
STABILITY
± 0.5 % R
± 0.5 % R
± 0.5 % R
± 0.5 % R
± 0.5 % R
CLASS 2
> 332 kΩ
> 2.4 MΩ
no visible
no visible
no visible
± 2 % R
damage
damage
damage
> 1 MΩ