DFLZ33-7 Diodes Inc, DFLZ33-7 Datasheet
DFLZ33-7
Specifications of DFLZ33-7
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DFLZ33-7 Summary of contents
Page 1
... Thermal Resistance Junction to Soldering Point (Note 3) Operating and Storage Temperature Range Notes: 1. Device mounted on 1" x 1", FR-4 PCB; 2 oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes. 3. Theoretical R calculated from the top center of the die straight down to the PCB/cathode tab solder junction. θ ...
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... DFLZ18 FJF 18 16.8 DFLZ20 FJG 20 18.8 DFLZ22 FJK 22 20.8 DFLZ24 FJL 24 22.8 DFLZ27 FJN 27 25.1 DFLZ30 FJQ 30 28 DFLZ33 FJR 33 31 DFLZ36 FJS 36 34 DFLZ39 FJT 39 37 Notes: 4. Short duration pulse test used to minimize self-heating effect. 1.2 1.0 0.8 0.6 0.4 0 ...
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... Code R S Month Jan Feb Code 1 2 Package Outline Dimensions PowerDI is a registered trademark of Diodes Incorporated. DFLZ5V1 - DFLZ39 Document number: DS30464 Rev 1MHz T = 25°C A 100 Packaging ® PowerDI 123 Fxx = Product Type Marking Code (See Electrical Characteristics Table) Fxx YM = Date Code Marking ...
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... Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages ...