MDP1603330RGE04 Vishay, MDP1603330RGE04 Datasheet - Page 2
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MDP1603330RGE04
Manufacturer Part Number
MDP1603330RGE04
Description
MDP16-03 330 2% E04 E1
Manufacturer
Vishay
Series
MDPr
Type
Networkr
Datasheets
1.MDP16012K00GE04.pdf
(5 pages)
2.MDP1603330KGE04.pdf
(5 pages)
3.MDP1603330RGE04.pdf
(5 pages)
Specifications of MDP1603330RGE04
Resistance (ohms)
330
Number Of Resistors
8
Circuit Type
Isolated
Temperature Coefficient
±100ppm/°C
Tolerance
±2%
Power Per Element
250mW
Number Of Pins
16
Package / Case
16-DIP (0.300", 7.62mm)
Size / Dimension
0.850" L x 0.310" W (21.59mm x 7.87mm)
Height
0.120" (3.05mm)
Mounting Type
Through Hole
Operating Temperature
-55°C ~ 125°C
Technology
Thick Film
Resistance
330Ohm
Power Rating
1.92W
Power Rating Per Resistor
1/4W
Tolerance (+ Or -)
2%
Circuit Designator
ISOL
Mounting Style
Through Hole
Military Standard
Not Required
Operating Temp Range
-55C to 125C
No. Of Terminals
16
Case Style
Molded
Failure Rate
Not Required
Termination Style
Pin
Terminal Pitch
2.54
Product Length (mm)
21.59mm
Product Depth (mm)
7.87mm
Product Height (mm)
3.81mm
Product Type
Networks
Operating Temperature Range
- 55 C to + 125 C
Dimensions
7.87 mm W x 19.05 mm L x 3.05 mm H
Lead Spacing
2.54 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Document Number: 31511
Revision: 28-Jul-06
DIMENSIONS in inches [millimeters]
GLOBAL MODEL
MDP 14
MDP 16
TECHNICAL SPECIFICATIONS
PARAMETER
Package Power Rating (Maximum at + 70 °C)
Voltage Coefficient of Resistance
Dielectric Strength
Insulation Resistance
Operating Temperature Range
Storage Temperature Range
MECHANICAL SPECIFICATIONS
Terminals:
Identification
Marking Resistance to Solvents:
Solderability:
Body:
Weight:
Pin #1
Pin #1
Thick Film Resistor Networks, Dual-In-Line,
Molded DIP, 01, 03, 05 Schematics
For technical questions contact: ff2aresistors@vishay.com
Non-Accumulative Tol.
0.750 [19.05]
0.850 [21.59]
0.075
[1.90
"C" Spaces
[2.54
A
0.100
±
±
0.381]
0.015
±
±
0.254]
0.010
UNIT
VAC
V
°C
°C
W
Ω
eff
B
Permanency testing per MIL-STD-202, Method 215
A
±
±
0.010 [0.254]
[0.457
0.010 [0.254]
0.018
14 pin = 1.3 grams; 16 pin = 1.5 grams
±
±
Per MIL-STD-202, Method 208E
0.003
0.076]
0.600 [15.24]
0.700 [17.78]
Solder plated leads
B
Molded epoxy
[0.762] Typ.
[1.27
0.050
MDP14
0.030
1.73
±
±
0.127]
0.005
0.120
[3.05
0.130 + 0.015
[3.30 + 0.381
> 10 000M minimum
±
±
- 0.254]
< 50 ppm typical
0.127]
- 0.010
0.005
- 55 to + 150
- 55 to + 125
200
MDP 01, 03, 05
0.310
[7.87
0.320 Nom.
0.360 Max.
0.290 Min.
9.14 Max.]
[7.37 Min.
8.13 Nom.
±
Vishay Dale
±
0.254]
0.010
MDP16
C
6
7
1.92
www.vishay.com
0.250
[6.35
[0.254 + 0.127
0.010 + 0.005
±
±
0.127]
0.005
- 0.051]
- 0.002
2