SMD Inductors(Coils)
For Signal Line(Multilayer, Magnetic Shielded)
MLF Series MLF1005L
Various digital devices are required to be further downsized yet
remain highly functional, and to excel in low power consumption,
and parts mounted on the devices are also required to have lower
resistance.
The MLF1005L type is a new line of inductors that have been
developed to meet such requirements: their resistance has been
lowered by up to 35% in comparison with that of the existing
MLF1005 type.
In addition, the new inductors use similar magnetic shielding,
which enables their high-density mounting.
FEATURES
• The resistance of the MLF1005L type has been lowered by up to
• Magnetically shielded configuration allowing for high-density
• Does not contain lead and is compatible with lead-free
• It is a product conforming to RoHS directive.
APPLICATIONS
Signal processing modules such as cellular phones and tuners
SPECIFICATIONS
Operating temperature range
Storage temperature range
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• Please contact our Sales office when your application are considered the following:
• All specifications are subject to change without notice.
250 to 260˚C
230˚C
180˚C
150˚C
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
35% in comparison with that of the existing MLF1005 type.
mounting.
soldering.
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
10s max.
–40 to +85°C
–40 to +85°C
Natural
cooling
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Material code
(4) Inductance value
(5) Inductance tolerance
(6) Packaging style
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
• After mounting components onto the printed circuit board, do not
• The inductance value may change due to magnetic saturation if
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
MLF 1005 L R10 K
(1)
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
apply stress through board bending or mishandling.
the current exceeds the rated maximum.
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
1005
L
R10
1R0
K
T
(2)
(3) (4) (5) (6)
T
Quantity
10000 pieces/reel
001-03 / 20100930 / e511_mlf1005l.fm
Taping [reel]
1.0×0.5×0.5
Low-resistance type
0.1µH
1.0µH
±10%
Conformity to RoHS Directive
(1/3)