MM3Z6V8T1G ON Semiconductor, MM3Z6V8T1G Datasheet - Page 5

• Manufacturer Part Number: MM3Z6V8T1G
• Description: DIODE ZENER 6.8V 200MW SOD-323
• Manufacturer: ON Semiconductor
• Type: Voltage Regulatorr

Specifications of MM3Z6V8T1G

• Voltage - Zener (nom) (vz): 6.8V
• Voltage - Forward (vf) (max) @ If: 900mV @ 10mA
• Current - Reverse Leakage @ Vr: 2µA @ 4V
• Power - Max: 200mW
• Impedance (max) (zzt): 15 Ohm
• Mounting Type: Surface Mount
• Package / Case: SC-76, SOD-323, UMD2
• Operating Temperature: -65°C ~ 150°C
• Zener Voltage: 6.8 V
• Voltage Tolerance: 6 %
• Voltage Temperature Coefficient: 2.85 mV / K
• Zener Current: 10 mA
• Power Dissipation: 200 mW
• Maximum Reverse Leakage Current: 2 uA
• Maximum Zener Impedance: 15 Ohms
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 65 C
• Configuration: Single
• Package Type: SOD-323
• Zener Voltage (typ): 6.8V
• Zener Test Current: 5mA
• Knee Impedance: 15Ohm
• Operating Temperature Classification: Military
• Rev Curr: 2uA
• Mounting: Surface Mount
• Pin Count: 2
• Operating Temp Range: -65C to 150C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Tolerance: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MM3Z6V8T1GOS; MM3Z6V8T1GOS; MM3Z6V8T1GOSTR

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NOTE 3
C
b
1
NOTE 5
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
L
H
D
E
2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
E
A1
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
MM3Z2V4T1 SERIES
http://onsemi.com
CASE 477−02
SOD−323
ISSUE G
A3
0.025
A
0.63
0.063
0.112
1.60
2.85
5
NOTES:
0.033
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
5. DIMENSION L IS MEASURED FROM END OF
0.83
Y14.5M, 1982.
WITH SOLDER PLATING.
FLASH, PROTRUSIONS OR GATE BURRS.
RADIUS.
STYLE 1:
DIM
H
A1
A3
PIN 1. CATHODE
A
C
D
E
b
L
E
0.089
2. ANODE
MIN
0.80
0.00
0.25
1.60
1.15
0.08
2.30
MILLIMETERS
0.15 REF
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NOM
0.90
0.05
0.32
0.12 0.177
1.70
1.25
2.50
MAX
1.00
0.10
1.80
1.35
2.70
0.4
0.031
0.000
0.010
0.003
0.062
0.045
0.003
0.090
MIN
0.006 REF
INCHES
0.035
0.002
0.012
0.005
0.066
0.049
0.098
NOM
MM3Z2V4T1/D
0.040
0.004
0.016
0.007
0.070
0.053
0.105
MAX