MMBZ5225BLT1G ON Semiconductor, MMBZ5225BLT1G Datasheet - Page 8

DIODE ZENER 3V 225MW SOT-23

MMBZ5225BLT1G

Manufacturer Part Number
MMBZ5225BLT1G
Description
DIODE ZENER 3V 225MW SOT-23
Manufacturer
ON Semiconductor
Type
Voltage Regulatorr
Datasheet

Specifications of MMBZ5225BLT1G

Voltage - Zener (nom) (vz)
3V
Voltage - Forward (vf) (max) @ If
900mV @ 10mA
Current - Reverse Leakage @ Vr
50µA @ 1V
Power - Max
225mW
Impedance (max) (zzt)
29 Ohm
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Operating Temperature
-65°C ~ 150°C
Zener Voltage
3 V
Voltage Tolerance
5 %
Zener Current
10 mA
Power Dissipation
300 mW
Maximum Reverse Leakage Current
50 uA
Maximum Zener Impedance
29 Ohms
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Configuration
Single
Package Type
SOT-23
Zener Voltage (typ)
3V
Zener Test Current
20mA
Knee Impedance
29Ohm
Operating Temperature Classification
Military
Rev Curr
50uA
Mounting
Surface Mount
Pin Count
3
Operating Temp Range
-65C to 150C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Tolerance
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MMBZ5225BLT1GOS
MMBZ5225BLT1GOS
MMBZ5225BLT1GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MMBZ5225BLT1G
Manufacturer:
ON
Quantity:
15 000
Part Number:
MMBZ5225BLT1G
Manufacturer:
ON
Quantity:
30 000
Part Number:
MMBZ5225BLT1G
Manufacturer:
ON
Quantity:
30 000
Part Number:
MMBZ5225BLT1G
Manufacturer:
LRC/乐山
Quantity:
20 000
Final Product/Process Change Notification #16266
SC88 and SC88A
MSQA6V1W5T2G
Test:
Precondition
Autoclave+PC Ta=121C RH=100% ~15 psig
TC+PC Ta= -65 C to 150 C
HTSL
DPA Per AECQ101, after 1000 cyc TC
RSH
ELECTRICAL CHARACTERIZATION PLAN:
Datasheet specifications and product electrical performance will remain unchanged
Characterization of each qual vehicle device will be performed to the following requirements:
ELECTRICAL CHARACTERIZATION RESULTS:
Available upon request
CHANGED PART IDENTIFICATION:
Products assembled with the Copper Wire from the ON Semiconductor facility will have a Finish
Good Date Code representing Work Week 35, 2009 (date code 9) or newer.
Issue Date: 08 Jun 2009
1) Three temperature characterization on 30 units from 3 lots
2) ESD performance ( HBM, MM) on 15 units from 1 lot
MSL1@ 260C , 3 X IR at 260 C/260 C
Ta=150C
Ta=260C, 10 sec dwell
Conditions:
Rev.14 Jun 2007
Interval:
1000 cyc
1008 hrs
96 hrs
Results
0/480
0/240
0/240
0/240
0/6
0/90
Page 8 of 36

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