MSP10C01130RGDA Vishay, MSP10C01130RGDA Datasheet - Page 2

• Manufacturer Part Number: MSP10C01130RGDA
• Description: MSP10C-01 130 2% D03
• Manufacturer: Vishay
• Type: Networkr

Specifications of MSP10C01130RGDA

• Technology: Thick Film
• Resistance: 130Ohm
• Power Rating: 1.6W
• Power Rating Per Resistor: 1/4W
• Number Of Resistors: 9
• Tolerance (+ Or -): 2%
• Circuit Designator: BUS
• Package / Case: SIP
• Mounting Style: Through Hole
• Temperature Coefficient: ±100
• Military Standard: Not Required
• Operating Temp Range: -55C to 125C
• No. Of Terminals: 10
• Case Style: Molded
• Failure Rate: Not Required
• Termination Style: Pin
• Terminal Pitch: 2.54
• Product Length (mm): 25.15mm
• Product Depth (mm): 2.29mm
• Product Height (mm): 8.89mm
• Lead Free Status / RoHS Status: Not Compliant

MSP
Vishay Dale
DIMENSIONS in inches (millimeters)
www.vishay.com
2
GLOBAL MODEL
MSP06
MSP08
MSP10
MSP09
TECHNICAL SPECIFICATIONS
PARAMETER
Package Power Rating
Maximum at + 25 °C and + 70 °C
Voltage Coefficient of Resistance
Dielectric Strength
Isolation Resistance (03 Schematic)
Operating Temperature Range
Storage Temperature Range
MECHANICAL SPECIFICATIONS
Marking Resistance to Solvents
Solderability
Body
Terminals
Weight
IMPEDANCE CODES
CODE
500B
750B
800C
990A
101C
111C
121B
121C
131A
0.040 ± 0.010
(1.02 ± 0.254)
Non-Accumulative
(2.54 ± 0.254)
0.100 ± 0.010
(0.381)
0.015
Min.
Pin #1
Thick Film Resistor Networks, Single-In-Line, Molded SIP
R
C Equal Space
120
130
160
180
180
180
220
220
1
82
(Ω)
(0.406 ± 0.076)
Max.
0.016 ± 0.003
For technical questions, contact:
A
B
0.590 (14.99)
0.790 (20.07)
0.990 (25.15)
0.890 (22.61)
A (Max.)
R
D Max.
0.135 + 0.015
130
200
210
260
240
270
390
270
330
(3.43 + 0.381
2
UNIT
(Ω)
V
V
°C
°C
Ω
AC
eff
- 0.254)
- 0.010
0.500 (12.70)
0.700 (17.78)
0.900 (22.86)
0.800 (20.32)
[e-mail]
CODE
141A
181A
191A
221B
281B
381B
501C
102A
202B
B
MSP09A = 0.55 g
MSP06A = 0.4 g
MSP08A = 0.5 g
MSP10A = 0.6 g
Permanency testing per MIL-STD-202, Method 215
Per MIL-STD-202, Method 208E, RMA flux
Copper alloy, solder plated
See Derating Curves
(0.305 ± 0.076)
0.012 ± 0.003
< 50 ppm typical
0.090 (2.29)
MSP SERIES
Molded epoxy
- 55 to + 125
- 55 to + 150
C
Max.
5
7
9
8
> 100 M
R
1.5K
200
270
330
330
330
560
560
620
1
3K
(Ω)
Document Number: 31510
MSP06C = 0.7 g
MSP08C = 0.9 g
MSP10C = 1.1 g
MSPxxA = 0.195 (4.95)
MSPxxC = 0.350 (8.89)
0.195 (4.95) only
Revision: 10-Jun-10
D (Max.)
R
1.2K
2.7K
3.3K
6.2K
270
390
470
680
560
2
(Ω)