BAS21LT3 ON Semiconductor, BAS21LT3 Datasheet - Page 6

Diodes (General Purpose, Power, Switching) 250V 200mA

BAS21LT3

Manufacturer Part Number
BAS21LT3
Description
Diodes (General Purpose, Power, Switching) 250V 200mA
Manufacturer
ON Semiconductor
Datasheet

Specifications of BAS21LT3

Product
Switching Diodes
Peak Reverse Voltage
250 V
Forward Continuous Current
0.2 A
Max Surge Current
0.625 A
Configuration
Single
Recovery Time
50 ns
Forward Voltage Drop
1.25 V
Maximum Reverse Leakage Current
0.1 uA
Operating Temperature Range
- 55 C to + 150 C
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 55 C
Mounting Style
SMD/SMT
Package / Case
SOT-23-3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAS21LT3G
Manufacturer:
ON
Quantity:
30 000
PUBLICATION ORDERING INFORMATION
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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S
H
5
1
A
2
G
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
D
4
3
BAS19LT1, BAS20LT1, BAS21LT1, BAS21DW5T1
5 PL
C
−B−
*For additional information on our Pb−Free strategy and soldering
0.0157
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.40
0.2 (0.008)
0.0197
M
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
0.50
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
B
M
SC−88A (SOT−353)
N
http://onsemi.com
CASE 419A−02
ISSUE G
K
0.0748
1.9
6
J
SCALE 20:1
NOTES:
1. DIMENSIONING AND TOLERANCING
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
4. DIMENSIONS A AND B DO NOT INCLUDE
PER ANSI Y14.5M, 1982.
419A−02.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
0.025
0.025
inches
A
B
C
D
G
H
K
N
S
0.65
0.65
J
mm
0.071
0.045
0.031
0.004
0.004
0.004
0.079
MIN
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
−−−
0.026 BSC
0.008 REF
INCHES
0.087
0.053
0.043
0.012
0.004
0.010
0.012
0.087
MAX
MILLIMETERS
MIN
1.80
1.15
0.80
0.10
0.10
0.10
2.00
−−−
0.65 BSC
0.20 REF
MAX
2.20
1.35
1.10
0.30
0.10
0.25
0.30
2.20
BAS19LT1/D

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