BZX884-B3V6,315 NXP Semiconductors, BZX884-B3V6,315 Datasheet - Page 3
![DIODE ZENER 3.6V 250MW SOD882](/photos/5/27/52797/sod-882_sml.jpg)
BZX884-B3V6,315
Manufacturer Part Number
BZX884-B3V6,315
Description
DIODE ZENER 3.6V 250MW SOD882
Manufacturer
NXP Semiconductors
Datasheet
1.BZX884-C43315.pdf
(10 pages)
Specifications of BZX884-B3V6,315
Voltage - Zener (nom) (vz)
3.6V
Voltage - Forward (vf) (max) @ If
900mV @ 10mA
Current - Reverse Leakage @ Vr
5µA @ 1V
Tolerance
±2%
Power - Max
250mW
Impedance (max) (zzt)
90 Ohm
Mounting Type
Surface Mount
Package / Case
SOD-882
Operating Temperature
-65°C ~ 150°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
934057188315
BZX884-B3V6 T/R
BZX884-B3V6 T/R
BZX884-B3V6 T/R
BZX884-B3V6 T/R
NXP Semiconductors
ORDERING INFORMATION
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1. Refer to SOD882 standard mounting conditions (footprint), FR4 with 60 μm copper strip line.
THERMAL CHARACTERISTICS
Note
1. Refer to SOD882 standard mounting conditions (footprint), FR4 with 60 μm copper strip line.
2004 Mar 26
BZX884-B2V4
to
BZX884-B75
BZX884-C2V4
to
BZX884-C75
I
I
P
T
T
R
F
ZSM
stg
j
tot
Voltage regulator diodes
th(j-a)
NUMBER
SYMBOL
SYMBOL
TYPE
continuous forward current
non-repetitive peak reverse
current
total power dissipation
storage temperature
junction temperature
thermal resistance from junction to ambient
NAME
−
−
PARAMETER
PARAMETER
Leadless ultra small plastic package;2 terminals; body 1.0 x
0.6 x 0.5 mm
Leadless ultra small plastic package;2 terminals; body 1.0 x
0.6 x 0.5 mm
t
T
T
p
amb
amb
= 100 μs; square wave;
3
= 25 °C; prior to surge
= 25 °C; note 1
DESCRIPTION
PACKAGE
CONDITIONS
note 1
CONDITIONS
−
see Tables 1 and
2
−
−65
−
MIN.
BZX884 series
Product data sheet
200
250
+150
150
VALUE
MAX.
500
VERSION
SOD882
SOD882
mA
mW
°C
°C
UNIT
UNIT
K/W