WM8523GEFL/RV Wolfson Microelectronics, WM8523GEFL/RV Datasheet - Page 49

IC, DAC, STEREO, 2VRMS, 2CH, 24QFN

WM8523GEFL/RV

Manufacturer Part Number
WM8523GEFL/RV
Description
IC, DAC, STEREO, 2VRMS, 2CH, 24QFN
Manufacturer
Wolfson Microelectronics
Datasheet

Specifications of WM8523GEFL/RV

Resolution (bits)
24bit
Sampling Rate
192kSPS
Input Channel Type
Serial
Digital Ic Case Style
QFN
No. Of Pins
24
Operating Temperature Range
-40°C To +85°C
Svhc
No SVHC (15-Dec-2010)
Package
RoHS Compliant
Data Interface
I2C, Serial, SPI
Supply Voltage Range - Analogue
2.97V To 3.63V
Rohs Compliant
Yes
Pre-Production
PACKAGE DIMENSIONS – 24-LEAD QFN
w
NOTES:
1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.30 mm FROM TERMINAL TIP.
2. FALLS WITHIN JEDEC, MO-220.
3. ALL DIMENSIONS ARE IN MILLIMETRES.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JEDEC 95-1 SPP-002.
5. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
6. REFER TO APPLICATIONS NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.
7. DEPENDING ON THE METHOD OF LEAD TERMINATION AT THE EDGE OF THE PACKAGE, PULL BACK (L1) MAY BE PRESENT.
8. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
FL: 24 PIN QFN PLASTIC PACKAGE 4
Symbols
A3
SEATING PLANE
REF:
C
bbb
aaa
ccc
A1
A3
D2
E2
G
A
D
E
b
e
L
A
13
18
Tolerances of Form and Position
19
MIN
12
0.70
0.20
2.65
2.65
0.35
0
e
BOTTOM VIEW
A3
SIDE VIEW
JEDEC, MO-220
EXPOSED
GROUND
PADDLE
Exposed lead
D2
0.203 REF
4.00 BSC
4.00 BSC
0.50 BSC
b
0.625
NOM
0.10
0.75
0.02
0.25
2.70
2.70
0.40
0.15
0.10
6
7
24
DETAIL 3
G
b
1
6
1
bbb
DETAIL 3
A1
MAX
0.80
0.05
0.30
2.75
2.75
0.45
M
X
A
C
E2
DETAIL 1
4
A
SEE DETAIL 2
X
B
0.75 mm BODY, 0.50 mm LEAD PITCH
ccc
0.08
C
C
NOTE
1
2
2
5
2 X
4
DETAIL 1
2 X
INDEX AREA
(D/2 X E/2)
aaa
0.3mm
aaa
C
EXPOSED
GROUND
PADDLE
C
45
degrees
TOP VIEW
D
DETAIL 2
Datum
R
L
E
DM061.A
PP, Rev 3.0, July 2009
e
Terminal
Tip
e/2
WM8523
49

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