AD5293BRUZ-50-RL7 Analog Devices Inc, AD5293BRUZ-50-RL7 Datasheet - Page 9

• Manufacturer Part Number: AD5293BRUZ-50-RL7
• Description: 1024 Tap, 1% DigiPOT With SPI Interface
• Manufacturer: Analog Devices Inc

Specifications of AD5293BRUZ-50-RL7

• Taps: 1024
• Resistance (ohms): 50K
• Number Of Circuits: 1
• Temperature Coefficient: 35 ppm/°C Typical
• Interface: SPI Serial
• Voltage - Supply: 9 V ~ 33 V, ±9 V ~ 16.5 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP
• Resistance In Ohms: 50K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Memory Type: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
T
Table 6.
Parameter
V
V
V
V
V
Digital Input and Output Voltage to GND
EXT_CAP Voltage to GND
I
Operating Temperature Range
Maximum Junction Temperature (T
Storage Temperature Range
Reflow Soldering
Package Power Dissipation
1
2
3
A
Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
Maximum continuous current.
Pulse duty factor.
DD
SS
LOGIC
DD
A
A
, I
, V
Continuous
Pulsed
Peak Temperature
Time at Peak Temperature
B
= 25°C, unless otherwise noted.
to GND
to GND
to V
, I
B
R
R
Frequency > 10 kHz
Frequency ≤ 10 kHz
, V
to GND
W
AB
AB
W
SS
= 20 kΩ
= 50 kΩ, 100 kΩ
1
to GND
J
max)
Rating
−0.3 V to +35 V
+0.3 V to −25 V
−0.3 V to +7 V
35 V
V
−0.3 V to V
−0.3 V to +7 V
±3 mA
±2 mA
MCC
MCC
−40°C to +105°C
150°C
−65°C to +150°C
260°C
20 sec to 40 sec
(T
SS
J
− 0.3 V, V
max − T
2
2
/√d
/d
3
3
LOGIC
A
DD
)/θ
+ 0.3 V
JA
+0.3 V
Rev. D | Page 9 of 24
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type
14-Lead TSSOP
1
ESD CAUTION
JEDEC 2S2P test board, still air (from 0 m/sec to 1 m/sec of air flow).
JA
is specified for the worst-case conditions, that is, a device
θ
93
JA
1
θ
20
JC
AD5293
Unit
°C/W