AD823ARZ-RL Analog Devices Inc, AD823ARZ-RL Datasheet - Page 6

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AD823ARZ-RL

Manufacturer Part Number
AD823ARZ-RL
Description
IC,Operational Amplifier,DUAL,BIPOLAR/JFET,SOP,8PIN,PLASTIC
Manufacturer
Analog Devices Inc
Type
General Purpose Amplifierr
Datasheet

Specifications of AD823ARZ-RL

Amplifier Type
J-FET
Number Of Circuits
2
Output Type
Rail-to-Rail
Slew Rate
25 V/µs
-3db Bandwidth
16MHz
Current - Input Bias
5pA
Voltage - Input Offset
700µV
Current - Supply
7mA
Current - Output / Channel
17mA
Voltage - Supply, Single/dual (±)
3 V ~ 36 V, ±1.5 V ~ 18 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Rail/rail I/o Type
Rail to Rail Output
Number Of Elements
2
Common Mode Rejection Ratio
60dB
Input Offset Voltage
800uV
Input Bias Current
25pA
Single Supply Voltage (typ)
5/9/12/15/18/24/28V
Dual Supply Voltage (typ)
±3/±5/±9/±12/±15V
Power Dissipation
900mW
Voltage Gain In Db
93.06dB
Power Supply Rejection Ratio
70dB
Power Supply Requirement
Single/Dual
Shut Down Feature
No
Single Supply Voltage (min)
3V
Single Supply Voltage (max)
36V
Dual Supply Voltage (min)
±1.5V
Dual Supply Voltage (max)
±18V
Technology
BiFET
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Package Type
SOIC N
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Gain Bandwidth Product
-
Lead Free Status / Rohs Status
Compliant

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AD823
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Internal Power Dissipation
Input Voltage (Common Mode)
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range N, R
Operating Temperature Range
Lead Temperature Range
(Soldering, 10 sec)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
PDIP (N)
SOIC (R)
Rating
36 V
1.3 W
0.9 W
±V
±V
See Figure 4
−65°C to +125°C
−40°C to +85°C
300°C
S
S
Rev. D | Page 6 of 20
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Specification is for device in free air.
Table 5. Thermal Resistance
Package Type
8-Lead PDIP
8-Lead SOIC
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
2.0
1.5
1.0
0.5
0
–50
Figure 4. Maximum Power Dissipation vs. Temperature
–40 –30 –20 –10 0
AMBIENT TEMPERATURE (°C)
8-LEAD PDIP
8-LEAD SOIC
10
20 30
θ
90
160
JA
40
50 60
T
J
70
= 150°C
Unit
°C/W
°C/W
80
90

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