AD8337-EVALZ-INV Analog Devices Inc, AD8337-EVALZ-INV Datasheet - Page 5

• Manufacturer Part Number: AD8337-EVALZ-INV
• Description: RoHS Compliant Eval Board.
• Manufacturer: Analog Devices Inc
• Series: X-AMP®r

Specifications of AD8337-EVALZ-INV

• Channels Per Ic: 1 - Single
• Amplifier Type: Voltage Feedback
• Output Type: Single-Ended
• Slew Rate: 625 V/µs
• -3db Bandwidth: 280MHz
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (main Ic): 18.5mA
• Voltage - Supply, Single/dual (±): ±2.5 V ~ 5 V
• Board Type: Fully Populated
• Utilized Ic / Part: AD8337
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output / Channel: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MEASUREMENT SETUP
As an example, Figure 8 shows board connections for two
generators. In this instance, the experiment illustrates IMD
measurements using standard off-the-shelf test equipment that
is used by Analog Devices, Inc. Of course, any equivalent
equipment can also be used.
BOARD LAYOUT CONSIDERATIONS
The AD8337 evaluation board is designed using four layers.
Interconnecting circuitry is located on the component and
wiring sides, with the inner layers dedicated to power and
ground planes. Figure 9 through Figure 13 show the copper
layouts.
TOP: SIGNAL GENERATOR
10.05MHz, 500mV p-p
BOTTOM: SIGNAL GENERATOR
9.95MHz, 500mV p-p
PREAMP OUTPUT
SIGNAL INPUT
Figure 8. Typical Board Test Connections (One Channel Shown)
POWER AMPLIFIERS
POWER SUPPLY
Rev. 0 | Page 5 of 8
–5V
For ease of assembly, all board components are located on the
primary side and all are 0603 size surface mounts. Higher
density applications can require components on both sides of
the board and present no problem to the AD8337, as
demonstrated in unreleased versions of the board that featured
secondary-side components and vias. Not evident in the figures
are thermal vias within the pad that solder to the mating pad of
the AD8337 chip-scale package. These vias serve as a thermal
path and are the primary means of removing heat from the
device. The thermal specifications in the
predicated on the use of multilayer board construction with
these thermal vias to enable heat conductivity from the die.
SPLITTER
POWER
+5V
SPECTRUM ANALYZER
VGAIN
AD8337
AD8337-EVAL
data sheet are