AD8655ARZ-REEL7 Analog Devices Inc, AD8655ARZ-REEL7 Datasheet - Page 5

• Manufacturer Part Number: AD8655ARZ-REEL7
• Description: IC,Operational Amplifier,SINGLE,CMOS,SOP,8PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Series: DigiTrim®r

Specifications of AD8655ARZ-REEL7

• Design Resources: Single Supply Low Noise LED Current Source Driver Using a Current Output DAC in the Reverse Mode (CN0139)
• Amplifier Type: General Purpose
• Number Of Circuits: 1
• Output Type: Rail-to-Rail
• Slew Rate: 11 V/µs
• Gain Bandwidth Product: 28MHz
• Current - Input Bias: 1pA
• Voltage - Input Offset: 50µV
• Current - Supply: 3.7mA
• Current - Output / Channel: 220mA
• Voltage - Supply, Single/dual (±): 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Input Voltage
Differential Input Voltage
Output Short-Circuit Duration
Electrostatic Discharge (HBM)
Storage Temperature Range
Junction Temperature Range
Lead Temperature
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
to GND
R, RM Packages
R, RM Packages
(Soldering, 10 sec)
Rating
6 V
VSS − 0.3 V to VDD + 0.3 V
±6 V
Indefinite
3.0 kV
−65°C to +150°C
−65°C to +150°C
260°C
Rev. A | Page 5 of 20
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 4.
Package Type
8-Lead MSOP (RM)
8-Lead SOIC (R)
1
θ
soldered in the circuit board for surface-mount packages.
JA
is specified for worst-case conditions; that is, θ
AD8655/AD8656
θ
210
158
JA
1
JA
is specified for a device
θ
45
43
JC
Unit
°C/W
°C/W