AD9516-4BCPZ-REEL7 Analog Devices Inc, AD9516-4BCPZ-REEL7 Datasheet - Page 54

• Manufacturer Part Number: AD9516-4BCPZ-REEL7
• Description: Clock IC With 1.8GHz On-chip VCO
• Manufacturer: Analog Devices Inc
• Type: Clock Generator, Fanout Distributionr

Specifications of AD9516-4BCPZ-REEL7

• Pll: Yes
• Input: Clock
• Output: CMOS, LVDS, LVPECL
• Number Of Circuits: 1
• Ratio - Input:output: 1:14
• Differential - Input:output: Yes/Yes
• Frequency - Max: 1.8GHz
• Divider/multiplier: Yes/No
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-LFCSP
• Frequency-max: 1.8GHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AD9516-4/PCBZ - BOARD EVAL FOR AD9516-4 1.8GHZ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD9516-4
THERMAL PERFORMANCE
Table 51. Thermal Parameters for the 64-Lead LFCSP
Symbol
θ
θ
θ
Ψ
θ
Ψ
The AD9516 is specified for a case temperature (T
that T
Use the following equation to determine the junction
temperature on the application PCB:
where:
T
T
top center of the package.
Ψ
PD is the power dissipation of the device (see Table 17).
JA
JMA
JMA
JC
J
CASE
JB
JT
JT
is the junction temperature (°C).
is the value from Table 51.
T
is the case temperature (°C) measured by the user at the
CASE
J
= T
is not exceeded, an airflow source can be used.
CASE
Thermal Characteristic Using a JEDEC JESD51-7 Plus JEDEC JESD51-5 2S2P Test Board
Junction-to-ambient thermal resistance, natural convection per JEDEC JESD51-2 (still air)
Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-ambient thermal resistance, 2.0 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-board characterization parameter, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
and JEDEC JESD51-8
Junction-to-case thermal resistance (die-to-heat sink) per MIL-STD-883, Method 1012.1
Junction-to-top-of-package characterization parameter, natural convection per JEDEC JESD51-2 (still air)
+ (Ψ
JT
× PD)
CASE
). To ensure
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Values of θ
design considerations. θ
approximation of T
where T
Values of θ
design considerations when an external heat sink is required.
Values of Ψ
design considerations.
T
J
= T
A
is the ambient temperature (°C).
A
JA
JC
JB
+ (θ
are provided for package comparison and PCB
are provided for package comparison and PCB
are provided for package comparison and PCB
JA
× PD)
J
by the following equation:
JA
can be used for a first-order
Value (°C/W)
22.0
19.2
17.2
11.6
1.3
0.1