AD9739BBC Analog Devices Inc, AD9739BBC Datasheet - Page 53

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AD9739BBC

Manufacturer Part Number
AD9739BBC
Description
14 Bit 2.5 GSPS DAC
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD9739BBC

Number Of Bits
14
Data Interface
Serial
Number Of Converters
1
Voltage Supply Source
Analog and Digital
Power Dissipation (max)
980mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
160-CSPBGA
Number Of Channels
1
Resolution
14b
Interface Type
LVDS
Single Supply Voltage (typ)
3.3V
Dual Supply Voltage (typ)
Not RequiredV
Power Supply Requirement
Analog and Digital
Output Type
Current
Integral Nonlinearity Error
±1.3LSB
Single Supply Voltage (min)
3.1V
Single Supply Voltage (max)
3.5V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
160
Package Type
CSP-BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Settling Time
-
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD9739BBCZ
Manufacturer:
EXAR
Quantity:
101
Part Number:
AD9739BBCZ
Manufacturer:
Analog Devices Inc
Quantity:
135
Part Number:
AD9739BBCZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD9739BBCZ
AD9739BBCZRL
AD9739BBC
AD9739BBCRL
AD9739-EBZ
AD9739-MIX-EBZ
AD9739-CMTS-EBZ
1
Z = RoHs Compliant Part.
1
1
1
1
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
1.40 MAX
Figure 111. 160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
DETAIL A
BALL A1
INDICATOR
TOP VIEW
12.10
12.00 SQ
11.90
COMPLIANT TO JEDEC STANDARDS MO-205-AE.
160- Ball Chip Scale Package Ball Grid Array [CSP_BGA]
160- Ball Chip Scale Package Ball Grid Array [CSP_BGA]
160- Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Evaluation Board for Normal Mode Evaluation
Evaluation Board for Mix Mode Evaluation
Evaluation Board for CMTS Evaluation
Package Description
160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Dimensions shown in millimeters
0.43 MAX
0.25 MIN
Rev. 0 | Page 53 of 56
(BC-160-1)
BSC SQ
10.40
REF
0.80
BALL DIAMETER
0.55
0.50
0.45
14
13
DETAIL A
12
11
10
BOTTOM
0.80 BSC
9
VIEW
8
SEATING
PLANE
7
INDEX AREA
A1 CORNER
6
5
4
3
2
1
1.00 MAX
0.85 MIN
0.12 MAX
COPLANARITY
B
D
E
H
K
L
M
N
P
A
C
F
G
J
Package Option
BC-160-1
BC-160-1
BC-160-1
BC-160-1
AD9739

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