ADA4851-4YRUZ-RL Analog Devices Inc, ADA4851-4YRUZ-RL Datasheet - Page 10

• Manufacturer Part Number: ADA4851-4YRUZ-RL
• Description: IC,Operational Amplifier,QUAD,BIPOLAR,TSSOP,14PIN,PLASTIC
• Manufacturer: Analog Devices Inc

Specifications of ADA4851-4YRUZ-RL

• Amplifier Type: Voltage Feedback
• Number Of Circuits: 4
• Output Type: Rail-to-Rail
• Slew Rate: 375 V/µs
• -3db Bandwidth: 105MHz
• Current - Input Bias: 2.2µA
• Voltage - Input Offset: 600µV
• Current - Supply: 2.9mA
• Current - Output / Channel: 125mA
• Voltage - Supply, Single/dual (±): 2.7 V ~ 12 V, ±1.35 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Gain Bandwidth Product: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Power Dissipation
Common-Mode Input Voltage
Differential Input Voltage
Storage Temperature Range
Operating Temperature Range
Lead Temperature
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
for device soldered in circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
6-lead SOT-23
8-lead MSOP
14-lead TSSOP
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4851-1/
ADA4851-2/ADA4851-4 is limited by the associated rise in
junction temperature (T
which is the glass transition temperature, the plastic changes its
properties. Even temporarily exceeding this temperature limit
may change the stresses that the package exerts on the die,
permanently shifting the parametric performance of the
amplifiers. Exceeding a junction temperature of 150°C for an
extended period can result in changes in silicon devices,
potentially causing degradation or loss of functionality.
The power dissipated in the package (P
quiescent power dissipation and the power dissipated in the die
due to the drive of the amplifier at the output. The quiescent
power is the voltage between the supply pins (V
quiescent current (I
ADA4851-1/ADA4851-2/ADA4851-4
JA
is specified for the worst-case conditions; that is, θ
S
).
J
) on the die. At approximately 150°C,
Rating
12.6 V
See Figure 5
−V
+V
−65°C to +125°C
−40°C to +125°C
JEDEC J-STD-20
150°C
θ
170
150
120
JA
S
S
D
) is the sum of the
− 0.5 V to +V
to −V
S
S
) times the
JA
Unit
°C/W
°C/W
°C/W
is specified
S
+ 0.5 V
Rev. J | Page 10 of 24
RMS output voltages should be considered. If R
to −V
V
worst case, when V
In single-supply operation with R
case is V
Airflow increases heat dissipation, effectively reducing θ
In addition, more metal directly in contact with the package
leads and through holes under the device reduces θ
Figure 5 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 6-lead SOT-23
(170°C/W), the 8-lead MSOP (150°C/W), and the 14-lead
TSSOP (120°C/W) on a JEDEC standard 4-layer board. θ
values are approximations.
ESD CAUTION
Figure 5. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
S
× I
P
2.0
1.5
1.0
0.5
P
P
S
OUT
D
0
D
D
, as in single-supply operation, the total drive power is
–55
= Quiescent Power + (Total Drive Power − Load Power)
=
=
OUT
. If the rms signal levels are indeterminate, consider the
–45 –35 –25 –15 –5
(
(
V
V
= V
S
S
×
×
SOT-23-6
I
I
S
S
S
/2.
)
)
+
+
OUT
AMBIENT TEMPERATURE (°C)
⎛
⎜
⎝
(
TSSOP
V
V
2
= V
S
R
S
5
4 /
L
×
15 25 35 45 55 65 75 85 95 105 115
MSOP
)
S
V
2
/4 for R
R
OUT
L
⎞
⎟
⎠
L
–
L
referenced to −V
V
to midsupply.
OUT
R
L
2
L
is referenced
JA
S
, the worst
.
125
JA
JA
.