ADA4855-3YCPZ-RL Analog Devices Inc, ADA4855-3YCPZ-RL Datasheet - Page 5
![Triple High Speed Extend Input Range RR](/photos/6/50/65061/505-16-lfcsp_sml.jpg)
ADA4855-3YCPZ-RL
Manufacturer Part Number
ADA4855-3YCPZ-RL
Description
Triple High Speed Extend Input Range RR
Manufacturer
Analog Devices Inc
Datasheet
1.ADA4855-3YCPZ-R7.pdf
(20 pages)
Specifications of ADA4855-3YCPZ-RL
Amplifier Type
Voltage Feedback
Number Of Circuits
3
Output Type
Rail-to-Rail
Slew Rate
870 V/µs
-3db Bandwidth
410MHz
Current - Input Bias
3.8µA
Voltage - Input Offset
1300µV
Current - Supply
7.8mA
Current - Output / Channel
57mA
Voltage - Supply, Single/dual (±)
3 V ~ 5.5 V
Operating Temperature
-40°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
16-LFCSP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Gain Bandwidth Product
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Internal Power Dissipation
Common-Mode Input Voltage
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
for a device soldered in a circuit board for surface-mount packages.
Table 4.
Package Type
16-Lead LFCSP
Specification is for device in free air.
JA
is specified for the worst-case conditions, that is, θ
1
θ
67
JA
Rating
6 V
See Figure 3
(−V
±V
Observe power curves
−65°C to +125°C
−40°C to +105°C
300°C
S
θ
17.5
S
− 0.2 V) to (+V
JC
JA
is specified
Unit
°C/W
S
− 1 V)
Rev. 0 | Page 5 of 20
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
ADA4855-3 is limited by the associated rise in junction
temperature. The maximum safe junction temperature for
plastic encapsulated devices is determined by the glass
transition temperature of the plastic, approximately 150°C.
Temporarily exceeding this limit may cause a shift in parametric
performance due to a change in the stresses exerted on the die
by the package. Exceeding a junction temperature of 175°C for
an extended period can result in device failure.
To ensure proper operation, it is necessary to observe the
maximum power derating curves.
ESD CAUTION
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
3.0
2.5
2.0
1.5
1.0
0.5
0
AMBIENT TEMPERATURE (°C)
ADA4855-3