ADUC7025BCPZ32-RL Analog Devices Inc, ADUC7025BCPZ32-RL Datasheet - Page 16
![IC,MICROCONTROLLER,16-BIT,ARM7 CPU,CMOS,LLCC,64PIN,PLASTIC](/photos/6/50/65021/505-64-lfcsp_sml.jpg)
ADUC7025BCPZ32-RL
Manufacturer Part Number
ADUC7025BCPZ32-RL
Description
IC,MICROCONTROLLER,16-BIT,ARM7 CPU,CMOS,LLCC,64PIN,PLASTIC
Manufacturer
Analog Devices Inc
Series
MicroConverter® ADuC7xxxr
Datasheet
1.USB-I2CLIN-CONV-Z.pdf
(96 pages)
Specifications of ADUC7025BCPZ32-RL
Core Processor
ARM7
Core Size
16/32-Bit
Speed
44MHz
Connectivity
EBI/EMI, I²C, SPI, UART/USART
Peripherals
PLA, PWM, PSM, Temp Sensor, WDT
Number Of I /o
30
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-LFCSP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ADuC7019/20/21/22/24/25/26/27/28/29
ABSOLUTE MAXIMUM RATINGS
AGND = REFGND = DACGND = GND
otherwise noted.
Table 10.
Parameter
AV
AGND to DGND
IOV
Digital Input Voltage to IOGND
Digital Output Voltage to IOGND
V
Analog Inputs to AGND
Analog Outputs to AGND
Operating Temperature Range, Industrial
Storage Temperature Range
Junction Temperature
θ
Peak Solder Reflow Temperature
JA
REF
49-Ball CSP_BGA
SnPb Assemblies (10 sec to 30 sec)
RoHS Compliant Assemblies
40-Lead LFCSP
64-Lead LFCSP
64-Ball CSP_BGA
64-Lead LQFP
80-Lead LQFP
DD
Thermal Impedance
DD
to AGND
(20 sec to 40 sec)
to IOV
to IOGND, AV
DD
DD
to AGND
REF
Rating
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +6 V
−0.3 V to +5.3 V
−0.3 V to IOV
−0.3 V to AV
−0.3 V to AV
−0.3 V to AV
–40°C to +125°C
–65°C to +150°C
150°C
26°C/W
80°C/W
24°C/W
75°C/W
47°C/W
38°C/W
240°C
260°C
, T
A
= 25°C, unless
DD
DD
DD
DD
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
Rev. C | Page 16 of 96
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any one time.
ESD CAUTION