AM29LV160DT-120EC Spansion Inc., AM29LV160DT-120EC Datasheet - Page 2

• Manufacturer Part Number: AM29LV160DT-120EC
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of AM29LV160DT-120EC

• Memory Configuration: 2M X 8 / 1M X 16 Bit
• Package/case: 48-TSOP
• Supply Voltage Max: 3.6V
• Leaded Process Compatible: No
• Peak Reflow Compatible (260 C): No
• Access Time, Tacc: 120nS
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

GENERAL DESCRIPTION
The Am29LV160D is a 16 Mbit, 3.0 Volt-only Flash
memory organized as 2,097,152 bytes or 1,048,576
words. The device is offered in 48-ball FBGA, 44-pin
SO, and 48-pin TSOP packages. The word-wide data
(x16) appears on DQ15–DQ0; the byte-wide (x8) data
appears on DQ7–DQ0. This device is designed to be
programmed in-system with the standard system 3.0
volt V
required for write or erase operations. The device can
a l s o
EPROM programmers.
The device offers access times of 70, 90, and 120 ns,
allowing high speed microprocessors to operate
without wait states. To eliminate bus contention the
device has separate chip enable (CE#), write enable
(WE#) and output enable (OE#) controls.
The device requires only a single 3.0 volt power
supply for both read and write functions. Internally
generated and regulated voltages are provided for the
program and erase operations.
The Am29LV160D is entirely command set compatible
with the JEDEC single-power-supply Flash stan-
dard. Commands are written to the command register
using standard microprocessor write timings. Register
contents serve as input to an internal state-machine
that controls the erase and programming circuitry.
Write cycles also internally latch addresses and data
needed for the programming and erase operations.
Reading data out of the device is similar to reading
from other Flash or EPROM devices.
Device programming occurs by executing the program
command sequence. This initiates the Embedded
Program algorithm—an internal algorithm that auto-
matically times the program pulse widths and verifies
proper cell margin. The Unlock Bypass mode facili-
tates faster programming times by requiring only two
write cycles to program data instead of four.
Device erasure occurs by executing the erase
command sequence. This initiates the Embedded
Erase algorithm—an internal algorithm that automati-
cally preprograms the array (if it is not already pro-
grammed) before executing the erase operation.
During erase, the device automatically times the erase
pulse widths and verifies proper cell margin.
2
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supply. A 12.0 V V
p r o g r a m m e d
PP
or 5.0 V
i n
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s t a n d a r d
are not
Am29LV160D
The host system can detect whether a program or
erase operation is complete by observing the RY/BY#
pin, or by reading the DQ7 (Data# Polling) and DQ6
(toggle) status bits. After a program or erase cycle has
been completed, the device is ready to read array data
or accept another command.
The sector erase architecture allows memory sectors
to be erased and reprogrammed without affecting the
data contents of other sectors. The device is fully
erased when shipped from the factory.
Hardware data protection measures include a low
V
tions during power transitions. The hardware sector
protection feature disables both program and erase
operations in any combination of the sectors of
memory. This can be achieved in-system or via pro-
gramming equipment.
The Erase Suspend/Erase Resume feature enables
the user to put erase on hold for any period of time to
read data from, or program data to, any sector that is
not selected for erasure. True background erase can
thus be achieved.
The hardware RESET# pin terminates any operation
in progress and resets the internal state machine to
reading array data. The RESET# pin may be tied to the
system reset circuitry. A system reset would thus also
reset the device, enabling the system microprocessor
to read the boot-up firmware from the Flash memory.
The device offers two power-saving features. When
addresses have been stable for a specified amount of
time, the device enters the automatic sleep mode.
The system can also place the device into the standby
mode. Power consumption is greatly reduced in both
these modes.
AMD’s Flash technology combines years of Flash
memory manufacturing experience to produce the
highest levels of quality, reliability and cost effective-
ness. The device electrically erases all bits within a
sector simultaneously via Fowler-Nordheim tun-
neling. The data is programmed using hot electron
injection.
CC
detector that automatically inhibits write opera-