CY7C1347G-200AXC Cypress Semiconductor Corp, CY7C1347G-200AXC Datasheet - Page 21
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CY7C1347G-200AXC
Manufacturer Part Number
CY7C1347G-200AXC
Description
SRAM (Static RAM)
Manufacturer
Cypress Semiconductor Corp
Specifications of CY7C1347G-200AXC
Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
4.5M (128K x 36)
Speed
200MHz
Interface
Parallel
Voltage - Supply
3.15 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
100-LQFP
Density
4.5Mb
Access Time (max)
2.8ns
Sync/async
Synchronous
Architecture
SDR
Clock Freq (max)
200MHz
Operating Supply Voltage (typ)
3.3V
Address Bus
17b
Package Type
TQFP
Operating Temp Range
0C to 70C
Number Of Ports
4
Supply Current
265mA
Operating Supply Voltage (min)
3.135V
Operating Supply Voltage (max)
3.6V
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
100
Word Size
36b
Number Of Words
128K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
428-2115
CY7C1347G-200AXC
CY7C1347G-200AXC
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CY7C1347G-200AXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY7C1347G-200AXC
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Company:
Part Number:
CY7C1347G-200AXCT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Package Diagrams
Acronyms
Table 4. Acronyms Used in this Document
Document #: 38-05516 Rev. *H
DDR
FBGA
HSTL
JEDEC
JTAG
ODT
PLL
QDR
TAP
TCK
TDO
TDI
TMS
Acronym
double data rate
fine-pitch ball grid array
high-speed transceiver logic
joint electron device engineering council
joint test action group
on-die termination
phase-locked loop
quad data rate
test access port
test clock
test data out
test data in
test mode select
(continued)
Description
Figure 11. 165-Ball FBGA (13 × 15 × 1.4 mm)
51-85180 *C
CY7C1347G
Page 21 of 23
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