DSPIC33FJ16GP304T-I/ML Microchip Technology, DSPIC33FJ16GP304T-I/ML Datasheet - Page 266
![16-bit DSC, 16KB Flash,40 MIPS,nanoWatt 44 QFN 8x8x0.9mm T/R](/photos/6/81/68122/150-44-qfn_sml.jpg)
DSPIC33FJ16GP304T-I/ML
Manufacturer Part Number
DSPIC33FJ16GP304T-I/ML
Description
16-bit DSC, 16KB Flash,40 MIPS,nanoWatt 44 QFN 8x8x0.9mm T/R
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ12MC201-ISO.pdf
(14 pages)
2.DSPIC33FJ16GP304-IPT.pdf
(284 pages)
3.DSPIC33FJ16GP304-IPT.pdf
(8 pages)
4.DSPIC33FJ16GP304-IPT.pdf
(14 pages)
Specifications of DSPIC33FJ16GP304T-I/ML
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
35
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 13x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
DSPIC33FJ16GP304T-I/MLTR
- DSPIC33FJ12MC201-ISO PDF datasheet
- DSPIC33FJ16GP304-IPT PDF datasheet #2
- DSPIC33FJ16GP304-IPT PDF datasheet #3
- DSPIC33FJ16GP304-IPT PDF datasheet #4
- Current page: 266 of 284
- Download datasheet (4Mb)
dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304
DS70290G-page 266
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
NOTE 1
e
b
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
Dimension Limits
φ
E1
Units
D1
L
A2
A1
L1
E1
N
A
E
D
e
L
φ
c
b
α
β
NOTE 2
E
A1
A
0.95
0.05
0.45
0.09
0.30
MIN
11°
11°
0°
–
MILLIMETERS
L1
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.80 BSC
1.00 REF
NOM
1.00
0.60
0.37
3.5°
12°
12°
44
Microchip Technology Drawing C04-076B
–
–
–
© 2011 Microchip Technology Inc.
α
MAX
1.20
1.05
0.15
0.75
0.20
0.45
13°
13°
7°
A2
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