MMBZ5232ELT1 ON Semiconductor, MMBZ5232ELT1 Datasheet - Page 6

• Manufacturer Part Number: MMBZ5232ELT1
• Description: DIODE ZENER 5.6V 225MW SOT-23
• Manufacturer: ON Semiconductor

Specifications of MMBZ5232ELT1

• Voltage - Zener (nom) (vz): 5.6V
• Voltage - Forward (vf) (max) @ If: 900mV @ 10mA
• Current - Reverse Leakage @ Vr: 5µA @ 3V
• Power - Max: 225mW
• Impedance (max) (zzt): 11 Ohm
• Mounting Type: Surface Mount
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Operating Temperature: -65°C ~ 150°C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Tolerance: -
• Other names: MMBZ5232ELT1OS

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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A
A1
E
1
3
D
e
2
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
b
H
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SEE VIEW C
0.037
0.95
0.035
0.9
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
MMBZ5221ELT1 Series
0.031
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
VIEW C
SOLDERING FOOTPRINT*
0.8
L1
L
http://onsemi.com
CASE 318−08
TO−236AB
ISSUE AM
q
SOT−23
0.25
6
SCALE 10:1
0.037
0.95
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
STANDARD 318−08.
DIM
0.079
A1
H
L1
inches
A
D
E
b
c
e
L
2.0
E
mm
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
MIN
MILLIMETERS
STYLE 8:
PIN 1. ANODE
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
2.40
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
2. NO CONNECTION
3. CATHODE
MAX
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
2.64
1.11
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
MIN
MMBZ5221ELT1/D
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
MAX