1SMB5936BT3G ON Semiconductor, 1SMB5936BT3G Datasheet - Page 6

DIODE ZENER 30V 3W SMB

1SMB5936BT3G

Manufacturer Part Number
1SMB5936BT3G
Description
DIODE ZENER 30V 3W SMB
Manufacturer
ON Semiconductor
Datasheets

Specifications of 1SMB5936BT3G

Voltage - Zener (nom) (vz)
30V
Voltage - Forward (vf) (max) @ If
1.5V @ 200mA
Current - Reverse Leakage @ Vr
1µA @ 22.8V
Tolerance
±5%
Power - Max
3W
Impedance (max) (zzt)
28 Ohm
Mounting Type
Surface Mount
Package / Case
DO-214AA, SMB
Operating Temperature
-65°C ~ 150°C
Zener Voltage
30 V
Voltage Tolerance
5 %
Zener Current
50 mA
Power Dissipation
550 mW
Maximum Reverse Leakage Current
1 uA
Maximum Zener Impedance
28 Ohms
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Current, Forward
200 mA
Current, Reverse
12.5 mA
Package Type
SMB
Primary Type
Zener
Temperature, Junction, Maximum
+150 °C
Temperature, Operating
-65 to +150 °C
Voltage, Forward
1.5 V
Voltage, Reverse
30 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
1SMB5936BT3GOSTR

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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L
H
E
E
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
L1
b
c
*For additional information on our Pb−Free strategy and soldering
D
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
2.743
0.108
A1
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
1SMB5913BT3 Series
SOLDERING FOOTPRINT*
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
2.159
0.085
http://onsemi.com
CASE 403A−03
ISSUE E
SMB
6
2.261
0.089
A
SCALE 8:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
DIM
H
A1
L1
A
D
D
b
c
E
L
E
inches
mm
MIN
1.90
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
0.51 REF
NOM
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
2.13
0.10
2.03
0.23
3.56
4.32
5.44
1.02
MAX
2.41
0.15
2.11
0.30
3.81
4.57
5.59
1.27
0.075
0.002
0.077
0.006
0.130
0.160
0.205
0.030
MIN
1SMB5913BT3/D
0.020 REF
INCHES
0.084
0.004
0.080
0.009
0.140
0.170
0.214
0.040
NOM
0.095
0.006
0.083
0.012
0.150
0.180
0.220
0.050
MAX

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