MT9P031I12STM Aptina LLC, MT9P031I12STM Datasheet - Page 9

• Manufacturer Part Number: MT9P031I12STM
• Description: SENSOR IMAGE 5MP MONO CMOS 48LCC
• Manufacturer: Aptina LLC
• Type: CMOS Imagingr

Specifications of MT9P031I12STM

• Package / Case: 48-iLCC
• Pixel Size: 2.2µm x 2.2µm
• Active Pixel Array: 2592H x 1944V
• Frames Per Second: 60
• Voltage - Supply: 2.6 V ~ 3.1 V
• Supply Voltage Range: 1.7V To 3.1V, 1.7V To 1.9V, 2.6V To 3.1V
• Operating Temperature Range: -30°C To +70°C
• Digital Ic Case Style: PLCC
• No. Of Pins: 48
• Supply Voltage Max: 3.1V
• Ic Function: Digital Image Sensor
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 557-1430 - KIT HEAD BOARD FOR MT9P031557-1429 - KIT DEV FOR MT9P031
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 557-1397; Q3884047; Q3956538; Q4007187

Readout Modes
Subsampling
Skipping
Binning
PDF: 09005aef824c993e/Source: 09005aef824c9943
MT9P031_5100_PB_2.fm - Rev. B 8/07 EN
By default, the resolution of the output image is the full width and height of the FOV as
defined above. The output resolution can be reduced by two methods: skipping and bin-
ning.
Row and column skip modes use subsampling to reduce the output resolution without
reducing field-of-view. The MT9P031 also has row and column binning modes, which
can reduce the impact of aliasing introduced by the use of skip modes. This is achieved
by the averaging of two or three adjacent rows and columns (adjacent same-color pix-
els). Both 2X and 4X binning modes are supported. Rows and columns can be binned
independently.
Skipping reduces resolution by using only selected pixels from the FOV in the output
image. In skip mode, entire rows and columns of pixels are not sampled, resulting in a
lower-resolution output image. A skip 2X mode skips one Bayer pair of pixels for every
pair output. Skip 3X skips two pairs for each one pair output. Rows and columns are
always read out in pairs.
Binning reduces resolution by combining adjacent, same-color imager pixels to produce
one output pixel. All of the pixels in the FOV contribute to the output image in bin mode.
This can result in a more pleasing output image with reduced subsampling artifacts. It
also improves low-light performance. For columns, the combination step can be either
an averaging or summing operation. Depending on lighting conditions, one or the other
may be desirable. In low-light conditions, summing produces a gain roughly equivalent
to the column bin factor.
Only certain combinations of binning and skipping are allowed.
MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor
9
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Functional Overview
©2006 Micron Technology, Inc. All rights reserved.