MBRP60035CTL ON Semiconductor, MBRP60035CTL Datasheet
MBRP60035CTL
Specifications of MBRP60035CTL
Available stocks
Related parts for MBRP60035CTL
MBRP60035CTL Summary of contents
Page 1
... Mold Compound Code A = Assembly Location YY = Year WW = Work Week G = Pb−Free Package ORDERING INFORMATION Device Package Shipping MBRP60035CTL POWERTAP II 25 Units/Tray MBRP60035CTLG POWERTAP II 25 Units/Tray (Pb−Free) Preferred devices are recommended choices for future use and best overall value. Publication Order Number: MBRP60035CTL/D ...
Page 2
THERMAL CHARACTERISTICS Rating Thermal Resistance, Junction−to−Case ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 300 Amps 25° 300 Amps 100° Maximum Instantaneous Reverse Current (Note 1) ...
Page 3
The POWERTAP package requires special mounting considerations because of the long longitudinal axis of the copper heat sink important to follow the proper tightening sequence to avoid warping the heat sink, which can reduce thermal contact between the ...
Page 4
... Q 0.270 0.285 6.86 7.23 R 3.150 BSC 80.01 BSC U 0.600 0.630 15.24 16.00 V 0.330 0.375 8.39 9.52 W 0.170 0.190 4.32 4.82 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MBRP60035CTL/D ...