1N5817 ON Semiconductor, 1N5817 Datasheet - Page 4
![Schottky (Diodes & Rectifiers) 1A 20V](/photos/27/7/270760/do15_sml.jpg)
1N5817
Manufacturer Part Number
1N5817
Description
Schottky (Diodes & Rectifiers) 1A 20V
Manufacturer
ON Semiconductor
Datasheet
1.1N5819.pdf
(7 pages)
Specifications of 1N5817
Product
Schottky Diodes
Peak Reverse Voltage
20 V
Forward Continuous Current
1 A @ Ta=55C
Max Surge Current
25 A
Configuration
Single
Forward Voltage Drop
0.75 V @ 3 A
Maximum Reverse Leakage Current
1000 uA
Operating Temperature Range
- 65 C to + 125 C
Mounting Style
Through Hole
Package / Case
DO-41
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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1N5817
Manufacturer:
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Quantity:
20 000
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Part Number:
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Manufacturer:
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Manufacturer:
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Quantity:
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Part Number:
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Company:
Part Number:
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Manufacturer:
TOSHIBA
Quantity:
150 000
(R
line values for preliminary engineering, or in case the tie
point temperature cannot be measured.
Mounting
90
80
70
60
50
40
30
20
10
Method
0.07
0.05
0.03
0.02
0.01
Data shown for thermal resistance, junction−to−ambient
qJA
1.0
0.7
0.5
0.3
0.2
0.1
2
3
1
1
0.1
) for the mountings shown is to be used as typical guide-
Figure 4. Steady−State Thermal Resistance
TYPICAL VALUES FOR R
1/8
NOTE 4. — MOUNTING DATA
BOTH LEADS TO HEATSINK,
0.2
1/8
52
67
EQUAL LENGTH
1/4
L, LEAD LENGTH (INCHES)
MAXIMUM
0.5
Lead Length, L (in)
3/8
1/4
65
80
1.0
50
1/2
1/2
72
87
qJA
2.0
5/8
TYPICAL
IN STILL AIR
100
3/4
85
3/4
5.0
1N5817, 1N5818, 1N5819
Figure 6. Thermal Response
7/8
10
http://onsemi.com
R
°C/W
°C/W
°C/W
qJA
t, TIME (ms)
1.0
20
4
0.07
0.05
5.0
3.0
2.0
1.0
0.7
0.5
0.3
0.2
0.1
L
VECTOR PIN MOUNTING
50
0.2
Mounting Method 1
Sine Wave
I
I
Capacitive
(FM)
(AV)
P.C. Board with
1−1/2″ x 1−1/2″
copper surface.
Loads
L
Mounting Method 2
= π (Resistive Load)
DT
DT
r(t) = normalized value of transient thermal resistance at time, t, from Figure 6,
i.e.:
r(t) =
100
t
JL
JL
Z
p
Figure 5. Forward Power Dissipation
qJL(t)
{
= P
= the increase in junction temperature above the lead temperature
r(t
1
pk
I
+ t
0.4
L
F(AV)
10
20
• R
5
p
= Z
) = normalized value of transient thermal resistance at time, t
200
qJL
t
, AVERAGE FORWARD CURRENT (AMP)
1
qJL
P
[D + (1 − D) • r(t
pk
• r(t)
L
0.6
1N5817−19
500
0.8
P
pk
1
TIME
+ t
p
1.0
L = 3/8″
) + r(t
1.0k
p
BOARD GROUND
DUTY CYCLE, D = t
PEAK POWER, P
an
equivalent square power pulse.
) − r(t
Mounting Method 3
T
1−1/2″ x 1−1/2″
copper surface.
PLANE
P.C. Board with
1
SQUARE WAVE
J
)] where
≈ 125°C
2.0k
2.0
pk
, is peak of
p
dc
/t
1
5.0k
1
+ t
p
.
10k
4.0