BAS40-04,215 NXP Semiconductors, BAS40-04,215 Datasheet - Page 17

• Manufacturer Part Number: BAS40-04,215
• Description: DIODE SCHOTTKY 40V 120MA SOT23
• Manufacturer: NXP Semiconductors

Specifications of BAS40-04,215

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Voltage - Forward (vf) (max) @ If: 1V @ 40mA
• Current - Reverse Leakage @ Vr: 10µA @ 40V
• Current - Average Rectified (io) (per Diode): 120mA (DC)
• Voltage - Dc Reverse (vr) (max): 40V
• Diode Type: Schottky
• Speed: Small Signal =< 200mA (Io), Any Speed
• Diode Configuration: 1 Pair Series Connection
• Mounting Type: Surface Mount
• Product: Schottky Diodes
• Peak Reverse Voltage: 40 V
• Forward Continuous Current: 0.12 A
• Max Surge Current: 0.2 A
• Configuration: Dual Series
• Forward Voltage Drop: 1 V @ 0.04 A
• Maximum Reverse Leakage Current: 10 uA
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-1602-2; 933661850215; BAS40-04 T/R

NXP Semiconductors
BAS40_1PSXXSB4X_SER_8
Product data sheet
Fig 26. Reflow soldering footprint SOT363 (SC-88)
Fig 27. Wave soldering footprint SOT363 (SC-88)
4.5
2.35
1.5
1.3
(4×)
0.6
BAS40 series; 1PSxxSB4x series
(4×)
0.5
Rev. 08 — 13 January 2010
2.45
5.3
(4×)
(4×)
0.5
0.6
1.3
2.65
1.8
(2×)
0.6
1.5
1.5
0.4 (2×)
0.3
2.5
General-purpose Schottky diodes
Dimensions in mm
direction during soldering
Dimensions in mm
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
preferred transport
sot363_fr
solder lands
solder resist
occupied area
sot363_fw
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