MBRP60035CTLG ON Semiconductor, MBRP60035CTLG Datasheet
MBRP60035CTLG
Specifications of MBRP60035CTLG
Related parts for MBRP60035CTLG
MBRP60035CTLG Summary of contents
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... Mold Compound Code A = Assembly Location YY = Year WW = Work Week G = Pb−Free Package ORDERING INFORMATION Device Package Shipping MBRP60035CTL POWERTAP II 25 Units/Tray MBRP60035CTLG POWERTAP II 25 Units/Tray (Pb−Free) Preferred devices are recommended choices for future use and best overall value. Publication Order Number: MBRP60035CTL/D ...
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THERMAL CHARACTERISTICS Rating Thermal Resistance, Junction−to−Case ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 300 Amps 25° 300 Amps 100° Maximum Instantaneous Reverse Current (Note 1) ...
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The POWERTAP package requires special mounting considerations because of the long longitudinal axis of the copper heat sink important to follow the proper tightening sequence to avoid warping the heat sink, which can reduce thermal contact between the ...
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... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...