TGF2022-24 TriQuint, TGF2022-24 Datasheet - Page 7

• Manufacturer Part Number: TGF2022-24
• Description: RF GaAs DC-20GHz 2.4mm Pwr pHEMT (0.35um)
• Manufacturer: TriQuint

Specifications of TGF2022-24

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1031681

TriQuint Semiconductor Texas: Phone [phone] Fax [phone] [e-mail] www.triquint.com
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during
handing, assembly and test.
1.297 [0.051]
0.000 [0.000]
Units: millimeters (inches)
Bond pads #1-4:
Bond pads # 5-8: (Drain) 0.090 x 0.090 (0.004 x 0.004)
Thickness: 0.100 (0.004)
Chip edge to bond pad dimensions are shown to center of bond pad
Chip size tolerance: +/- 0.051 (0.002)
GND IS BACKSIDE OF MMIC
GATE
Mechanical Drawing
1
3
2
4
(Gate)
NE
RC
B
0.090 x 0.090 (0.004 x 0.004)
5
6
7
8
RC
B
0.944 [0.037]
0.752 [0.030]
0.560 [0.022]
0.368 [0.015]
DRAIN
Product Datasheet
TGF2022-24
August 22, 2007
Rev -
7