LTC2242IUP-12 Linear Technology, LTC2242IUP-12 Datasheet - Page 28

• Manufacturer Part Number: LTC2242IUP-12
• Description: IC,A/D CONVERTER,SINGLE,12-BIT,CMOS,LLCC,64PIN
• Manufacturer: Linear Technology

PACKAGE DESCRIPTION
LTC2242-12
Please refer to
28
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1 TOP MARK
(SEE NOTE 5)
http://www.linear.com/designtools/packaging/
7.15 ±0.05
9 .00 ± 0.10
(4 SIDES)
7.15 ±0.05
0.50 BSC
0.25 ±0.05
(Reference LTC DWG # 05-08-1705 Rev C)
64-Lead Plastic QFN (9mm × 9mm)
(4 SIDES)
7.50 REF
PACKAGE OUTLINE
0.70 ±0.05
0.75 ± 0.05
8.10 ±0.05 9.50 ±0.05
UP Package
for the most recent package drawings.
(4-SIDES)
7.50 REF
R = 0.10
0.200 REF
0.00 – 0.05
TYP
7.15 ± 0.10
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
7.15 ± 0.10
CHAMFER
C = 0.35
PIN 1
0.50 BSC
0.25 ± 0.05
(UP64) QFN 0406 REV C
63
64
0.40 ± 0.10
1
2
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