LTC3208EUH Linear Technology, LTC3208EUH Datasheet - Page 23

• Manufacturer Part Number: LTC3208EUH
• Description: IC,Laser Diode/LED Driver,CMOS,LLCC,32PIN,PLASTIC
• Manufacturer: Linear Technology

PACKAGE DESCRIPTIO
5.50 ±0.05
4.10 ±0.05
3.45 ±0.05
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD LAYOUT
PIN 1
TOP MARK
(NOTE 6)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
5.00 ± 0.10
(4 SIDES)
U
0.50 BSC
0.25 ± 0.05
32-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1693)
0.70 ±0.05
PACKAGE OUTLINE
UH Package
0.75 ± 0.05
3.45 ± 0.10
(4-SIDES)
0.200 REF
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
31
0.50 BSC
0.25 ± 0.05
32
LTC3208
PIN 1 NOTCH R = 0.30 TYP
OR 0.35 × 45° CHAMFER
1
2
(UH32) QFN 1004
0.40 ± 0.10
23
3208fa