HFA16TA60CPBF Vishay, HFA16TA60CPBF Datasheet - Page 2

• Manufacturer Part Number: HFA16TA60CPBF
• Description: DIODE HEXFRED 600V 8A TO220AB
• Manufacturer: Vishay
• Series: HEXFRED®r

Specifications of HFA16TA60CPBF

• Diode Configuration: 1 Pair Common Cathode
• Diode Type: Standard
• Voltage - Forward (vf) (max) @ If: 1.7V @ 8A
• Current - Reverse Leakage @ Vr: 5µA @ 600V
• Current - Average Rectified (io) (per Diode): 8A (DC)
• Voltage - Dc Reverse (vr) (max): 600V
• Reverse Recovery Time (trr): 55ns
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Mounting Type: Through Hole
• Package / Case: TO-220-3 (Straight Leads)
• Product: Ultra Fast Recovery Rectifier
• Configuration: Dual Common Cathode
• Reverse Voltage: 600 V
• Forward Voltage Drop: 2.1 V
• Recovery Time: 55 ns
• Forward Continuous Current: 16 A
• Max Surge Current: 60 A
• Reverse Current Ir: 5 uA
• Mounting Style: Through Hole
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 55 C
• Repetitive Reverse Voltage Vrrm Max: 600V
• Forward Current If(av): 8A
• Forward Voltage Vf Max: 2.1V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: *HFA16TA60CPBF; VS-HFA16TA60CPBF; VS-HFA16TA60CPBF; VSHFA16TA60CPBF; VSHFA16TA60CPBF

HFA16TA60CPbF
Vishay High Power Products
www.vishay.com
2
ELECTRICAL SPECIFICATIONS PER LEG (T
PARAMETER
Cathode to anode
breakdown voltage
Maximum forward voltage
Maximum reverse
leakage current
Junction capacitance
Series inductance
DYNAMIC RECOVERY CHARACTERISTICS PER LEG (T
PARAMETER
Reverse recovery time
See fig. 5 and 10
Peak recovery current
See fig. 6
Reverse recovery charge
See fig. 7
Peak rate of fall recovery
current during t
See fig. 8
THERMAL - MECHANICAL SPECIFICATIONS PER LEG
PARAMETER
Lead temperature
Junction to case,
single leg conducting
Junction to case,
both legs conducting
Thermal resistance,
junction to ambient
Thermal resistance,
case to heatsink
Weight
Mounting torque
Marking device
b
dI
dI
SYMBOL
SYMBOL
SYMBOL
(rec)M
(rec)M
I
I
R
R
R
T
V
V
RRM1
RRM2
Q
Q
I
C
L
t
t
RM
thCS
t
lead
thJC
thJA
rr1
rr2
FM
BR
rr
S
rr1
rr2
T
For technical questions, contact: [e-mail]
/dt1
/dt2
I
I
I
I
V
T
V
Measured lead to lead 5 mm from package body
I
T
T
T
T
T
T
T
T
0.063" from case (1.6 mm) for 10 s
Typical socket mount
Mounting surface, flat, smooth and greased
Case style TO-220AB
Ultrafast Soft Recovery Diode, 2 x 8 A
R
F
F
F
F
J
R
R
J
J
J
J
J
J
J
J
= 8 A
= 16 A
= 8 A, T
= 100 µA
= 1.0 A, dI
= 125 °C, V
= 25 °C
= 125 °C
= 25 °C
= 125 °C
= 25 °C
= 125 °C
= 25 °C
= 125 °C
= V
= 200 V
R
rated
J
= 125 °C
TEST CONDITIONS
TEST CONDITIONS
TEST CONDITIONS
F
/dt = 200 A/µs, V
R
= 0.8 x V
J
= 25 °C unless otherwise specified)
HEXFRED
I
dI
V
R
F
R
F
= 8.0 A
rated
/dt = 200 A/µs
= 200 V
R
= 30 V
J
®
= 25 °C unless otherwise specified)
See fig. 1
See fig. 2
See fig. 3
MIN.
MIN.
(5.0)
MIN.
600
6.0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TYP.
TYP.
TYP.
0.07
124
240
210
100
3.5
4.5
0.5
2.0
1.4
1.7
1.4
0.3
8.0
HFA16TA60C
18
37
55
65
10
-
-
-
-
-
-
Document Number: 94058
MAX.
MAX.
MAX.
Revision: 25-Jul-08
1.75
(10)
138
360
300
500
1.7
2.1
1.7
5.0
5.0
8.0
3.5
25
55
90
80
12
-
-
-
-
-
-
-
-
kgf · cm
(lbf · in)
UNITS
UNITS
UNITS
A/µs
K/W
oz.
µA
pF
nH
nC
ns
°C
V
A
g