BAS40-06,215 NXP Semiconductors, BAS40-06,215 Datasheet - Page 18
![DIODE SCHOTTKY 40V 120MA SOT-23](/photos/5/24/52425/nxp_sot-23-3_to-236-3_micro3_ssd3_sst3_sml.jpg)
BAS40-06,215
Manufacturer Part Number
BAS40-06,215
Description
DIODE SCHOTTKY 40V 120MA SOT-23
Manufacturer
NXP Semiconductors
Datasheet
1.BAS40-05215.pdf
(21 pages)
Specifications of BAS40-06,215
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Mounting Type
Surface Mount
Speed
Small Signal =< 200mA (Io), Any Speed
Current - Reverse Leakage @ Vr
10µA @ 40V
Voltage - Forward (vf) (max) @ If
1V @ 40mA
Voltage - Dc Reverse (vr) (max)
40V
Current - Average Rectified (io) (per Diode)
120mA (DC)
Diode Configuration
1 Pair Common Anode
Product
Schottky Diodes
Peak Reverse Voltage
40 V
Forward Continuous Current
0.12 A
Max Surge Current
0.2 A
Configuration
Dual Common Anode
Forward Voltage Drop
1 V @ 0.04 A
Maximum Reverse Leakage Current
10 uA
Operating Temperature Range
+ 150 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
934034550215::BAS40-06 T/R::BAS40-06 T/R
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAS40-06,215
Manufacturer:
NEXPERIA/安世
Quantity:
20 000
NXP Semiconductors
BAS40_1PSXXSB4X_SER_8
Product data sheet
Fig 28. Reflow soldering footprint SOT416
Fig 29. Reflow soldering footprint SOT666
2
1.7
1.075
Reflow soldering is the only recommended soldering method.
0.538
0.55
(2×)
BAS40 series; 1PSxxSB4x series
Dimensions in mm
Rev. 08 — 13 January 2010
0.45
(4×)
(4×)
0.5
2.0
0.85
2.75
2.45
2.1
1.6
1.7
(3x)
0.6
0.6
solder lands
solder resist
3
0.65
(2×)
(2×)
0.7
0.6
2.2
1.9
2
1
1.1
(6×)
0.4
General-purpose Schottky diodes
0.325
0.25
(2×)
(4×)
msa438
(3x)
0.5
solder paste
occupied area
0.375
(2×)
(4×)
0.3
1.5
Dimensions in mm
© NXP B.V. 2010. All rights reserved.
solder lands
placement area
solder paste
occupied area
sot666_fr
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