BAS40-04,235 NXP Semiconductors, BAS40-04,235 Datasheet - Page 14

• Manufacturer Part Number: BAS40-04,235
• Description: DIODE SCHOTTKY 40V 120MA SOT-23
• Manufacturer: NXP Semiconductors

Specifications of BAS40-04,235

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Voltage - Forward (vf) (max) @ If: 1V @ 40mA
• Current - Reverse Leakage @ Vr: 10µA @ 40V
• Current - Average Rectified (io) (per Diode): 120mA (DC)
• Voltage - Dc Reverse (vr) (max): 40V
• Diode Type: Schottky
• Speed: Small Signal =< 200mA (Io), Any Speed
• Diode Configuration: 1 Pair Series Connection
• Mounting Type: Surface Mount
• Product: Schottky Diodes
• Peak Reverse Voltage: 40 V
• Forward Continuous Current: 0.12 A
• Max Surge Current: 0.2 A
• Configuration: Dual Series
• Forward Voltage Drop: 1 V @ 0.04 A
• Maximum Reverse Leakage Current: 10 uA
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 933661850235; BAS40-04 /T3; BAS40-04 /T3

NXP Semiconductors
BAS40_1PSXXSB4X_SER_8
Product data sheet
Fig 20. Reflow soldering footprint SOD123F
Fig 21. Reflow soldering footprint SOD882
2.1
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Dimensions in mm
1.6
R = 0.05 (8×)
solder lands
solder resist
occupied area
solder paste
BAS40 series; 1PSxxSB4x series
(2×)
1.1
Rev. 08 — 13 January 2010
0.90
4.4
2.9
1.6
4
0.30
0.40
0.50
(2×)
(2×)
(2×)
0.30
1.30
1.1 1.2
General-purpose Schottky diodes
R = 0.05 (8×)
0.60
(2×)
0.70
(2×)
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
mbl872
0.80
(2×)
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